[#sps] Siemens supports OPC Foundation Initiative to extend OPC UA, including TSN down to the field level

Active support of OPC UA and Time-Sensitive Networking (TSN) technology

Siemens welcomes the initiative previously published by the OPC Foundation to further enable OPC UA adoption throughout industrial automation by extending standardization and harmonization activities for OPC UA, including TSN-enabled Ethernet networks at the field level. Siemens, as a founding and board member of the OPC Foundation, is a strong supporter of the OPC UA technology and has been active in core standardization working groups for many years.

Siemens has extensive experience and a long history in the development and standardization of industrial communication systems. Siemens is actively participating in all relevant standardization bodies like IEEE, IEC, IETF, PI, OPC F, and many more not only as editor but also even as the convener and lead of the whole working group.
The latest example of Siemens leadership is the foundation of the international IEC/IEEE 60802 standardization group by Siemens. This group will standardize the so called “TSN Profile for Industrial Automation (TSN-IA Profile)” to ensure a multivendor converged TSN network approach for industrial automation where different applications and protocols like OPC UA, PROFINET, EtherNet/IP, etc. can share the same TSN network infrastructure. Additionally, an appropriate set of IEEE basic standards will be selected to run the different protocols on one and the same hardware base.

[#sps] Siemens supports OPC Foundation Initiative to extend OPC UA, including TSN down to the field level
Siemens begrüßt die von der OPC Foundation kürzlich bekanntgegebene Initiative, die Standardisierungs- und Harmonisierungsaktivitäten für OPC UA auch auf TSN-fähige Ethernet-Netzwerke für die Feldebene auszuweiten.
Siemens welcomes the initiative previously published by the OPC Foundation to further enable OPC UA adoption throughout industrial automation by extending standardization and harmonization activities for OPC UA, including TSN-enabled Ethernet networks at the field level.

Siemens shares the vision of the OPC Foundation to extend the scope of OPC UA down to field level communication and is looking forward to contributing in standardization activities in the upcoming working groups of the OPC Foundation concerning information models for devices, necessary adaption of OPC UA core standards, application profiles, etc.

Use cases which have not been well addressed in today’s industrial communication systems so far, like multi-vendor controller-to-controller communication or vertical communication from devices to upper systems via OPC UA, will be adopted first by the market. Therefore, joint working groups between PI and OPC F members were started several months ago. These working groups are addressing topics such as the standardization of Safety over OPC UA based on Profisafe mechanisms for controller-to-controller communication, and the mapping of Profinet into the OPC UA information model for multiple use cases, e.g. asset management and diagnostics. Customers can shortly benefit from these features without waiting for TSN by simply running the OPC UA protocols on existing PROFINET network installations. The PI organization contributes its technology expertise to the OPC Foundation, e.g. by opening the Profisafe mechanisms to be used via OPC UA and extending the respective rights to OPC Foundation members.

Field device level communications with cyclic IO communication, motion control and safety, will need an established ecosystem with stack providers, certification procedures, tools, and many more. Organizations like PI, ODVA, and others have put effort into completeness and quality of specifications, conformance testing, maintaining a vendor and user community, and we expect a similar approach with the new OPC Foundation setup.

Siemens bears high responsibility towards its installed base and therefore will continue in innovating Profinet to protect our customers’ investments and to bring Profinet based on TSN to the next level. The converged TSN network and common hardware platforms for Profinet and OPC UA enable a smooth migration into the new TSN world. In addition, we ensure that with OPC UA including TSN, the fundamental principles in field device communication, engineering workflows, conformance testing, diagnostics, etc. will stay unchanged.

In the end, our customers will decide if and where to use OPC UA technology or Profinet technology for their individual applications.

TSN 국제 표준 발표

뉴스레터 구독하기

아이씨엔매거진은 AIoT, IIoT 및 피지컬 AI, 디지털트윈을 통한 제조업 디지털전환 애널리틱스를 제공합니다.
테크리포트: 자율제조, 전력전자, 모빌리티, 로보틱스, 스마트농업

AW2026 expo
ACHEMA 2027
전시회 세미나 선물 준비는 기프트랩스
Hordon Kim
Hordon Kimhttps://powerelectronics.kr
아이씨엔매거진, PEMK(Power Electronics Magazine Korea) 인터내셔널 에디터입니다. An international editor of ICN magazine and PEMK.
fastech EtherCAT
as-interface
GiftLabs

Related Articles

Stay Connected

440FansLike
407FollowersFollow
224FollowersFollow
120FollowersFollow
372FollowersFollow
152SubscribersSubscribe
기프트랩스
spot_img
실시간 제어 TSN 표준
InterPACK
spot_img
SPS 2026
automotion
Power Electronics Mag

Latest Articles

Related Articles

PENGUIN Solutions
[이슈] 스마트 공장 통신 표준 완성… IEC/IEEE 60802 TSN 통합 표준 발표

[이슈] 스마트 공장 통신 표준 완성… IEC/IEEE 60802 TSN 통합 표준...

0
국제 표준화 기구인 IEC와 IEEE가 스마트 공장의 복잡한 통신망을 하나로 통합할 수 있는 'IEC/IEEE 60802' TSN 프로필 표준을 제정하고, 글로벌 주요 자동화 협회 및 반도체 기업들이 대거 동참했다.
WindEnergy
InterPACK

Related Articles

fastech EtherCAT
as-interface
인피니언, 300A 피크 전류 구현한 AI 가속기용 초고밀도 전력 반도체 출시

인피니언, 300A 피크 전류 구현한 AI 가속기용 초고밀도 전력 반도체 출시

0
인피니언이 손톱보다 작은 단일 칩으로 최대 300A의 전류를 안전하게 공급하고 최신 액체 냉각 시스템과 연동하여 AI 데이터센터의 전력 부족과 과열 문제를 해결하는 초고밀도 전력 반도체 신제품을 선보였다.
노르딕 세미컨덕터, 초소형·초저전력 멀티 프로토콜 SoC ‘nRF54LC10A’ 출시

노르딕 세미컨덕터, 초소형·초저전력 멀티 프로토콜 SoC ‘nRF54LC10A’ 출시

0
노르딕 세미컨덕터가 초소형 1.9x2.3mm 크기에 블루투스, 스레드, 매터 통신과 첨단 보안 기능을 통합한 저전력 반도체 nRF54LC10A를 출시하여 소형 IoT 기기 개발을 간소화했다.
래티스 반도체, 양자 내성 암호 탑재 FPGA ‘Mach-N2’ 및 AI 설계 툴 ‘Lattice Prompt’ 공개

래티스 반도체, 양자 내성 암호 탑재 FPGA ‘Mach-N2’ 및 AI 설계...

0
래티스가 양자 컴퓨터 해킹 공격을 방어하는 차세대 보안 칩과 함께 복잡한 회로를 자연어로 입력하면 AI가 자동으로 설계해 개발 기간을 획기적으로 줄여주는 기술을 발표했다

가전부터 서버까지 전력 손실 대폭 줄인다… ST, 고집적 PFC 컨트롤러 ‘L4983’...

0
ST마이크로일렉트롤닉스가 가전, 서버, 산업용 전원 장치의 전력 손실을 줄이고 회로 설계를 간소화하는 차세대 역률 보정(PFC) 반도체 L4983을 출시했다
배터리 방전 걱정 싹 지운다… ST, 초정밀 배터리 관리 칩 L9962 전격 출시

배터리 방전 걱정 싹 지운다… ST, 초정밀 배터리 관리 칩 L9962...

0
ST마이크로일렉트로닉스가 초정밀 전압 측정과 빠르고 안정적인 셀 밸런싱 기능을 갖춘 차세대 배터리 관리 반도체 L9962를 출시해 경량 전기차와 무선 공구의 배터리 수명을 대폭 연장했다.

초저전력 무선과 엣지 AI 한틀에 담았다… 마우저, 노르딕 최신 솔루션 전격...

0
마우저 일렉트로닉스가 엣지 인공지능 연산용 NPU 탑재 칩셋, 위성 통신 모듈, 초저전력 배터리 관리 반도체 등 노르딕 세미컨덕터의 최신 무선 개발 키트를 국내외 엔지니어들에게 공급한다
- Our Youtube Channel -Engineers Youtube Channel

Latest Articles