2026년 3월 4일, 수요일
식민지역사박물관
aw 2026

New technologies pair the physical with the digital

Digital twinning is one part of the technology road map for Industry 4.0 and the Industrial Internet of Things. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain.

Digital twinning seeks to improve the design and maintenance of physical systems by offering datadriven ways to discretely map these physical systems into digital and computerized replicas of themselves. With the arrival of automation and data exchange, digital twinning could be useful in a myriad of industrial applications.

This new industrial context, where the physical and the digital worlds meet, is known as the fourth industrial revolution—or Industry 4.0. Brought on by the intersection of a host of high-technology electronic and computer systems, the “new way” of Industry 4.0 promises increasing gains, efficiencies, and flexibility. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain. Digital twinning is only one part of the technology roadmap for Industry 4.0, as these additional technologies are helping to enable digital twinning for Industry 4.0 to manifest its potential:

• Pairing technologies
• Cyber-physical systems
• Augmented, virtual, and mixed reality
• Artificial intelligence
• Additive manufacturing
• 3D printing
• Digital thread

Pairing Technologies
Pairing technologies are critical to digital twinning and the world of Industry 4.0, as these technologies empower a device or system to find, connect, and communicate with other devices and systems. For example, sensors and the Industrial Internet of Things (IIoT) products require the ability to find and connect with other devices successfully. Technologies such as Bluetooth®, among others, are employed to make these connections. To accomplish this, connected devices must be able to interrogate other potentially connectable devices successfully. When inquiring other devices, units must be able to ascertain whether they are communicating with a unit that they should be corresponding and exchanging data with. When properly enabled and successful, this accomplishment is called pairing.

Security issues are paramount. Every device should pair only after proper identification has been confirmed to avoid crosstalk or misinformation. Shortcuts may be achieved through programming algorithms that allow the devices to quickly and easily identify other units that they should pair with. Pairing gets accomplished through authentication keys employing cryptography. Pairing works to ensure that the connections stay bonded in a data exchanging relationship between devices and works to prevent an external source from prying into their data exchanges.

Being that flexibility is paramount, units must be able to make and break their pairing quickly and without external, human involvement. Successful pairing may require ongoing communication to keep the pairing active. If one of the units determines that the pairing bond is no longer relevant to its successful operational objectives, it will remove its pairing relationship and present itself available for a different pairing opportunity.

(photo. Mouser Electronics)

Cyber-Physical Systems
The National Science Foundation (NSF) defines cyber-physical systems (CPS) as, “The tight conjoining of and coordination between computational and physical resources.” The critical element in this definition is that it focuses on a system approach— where a set of connected things or parts form a complex whole.

A current example of a CPS is the automated airline flight-control systems. Industry 4.0 requires traffic control, not for airplanes, but for the machines, computers, robots, sensors, and processes that comprehensively work together for its realization. It represents a system of higher order than IIoT, because it sits one level higher in the complexity chain. Where IIoT is concerned with collecting, handling, and sharing of large amounts of data, CPS is focused on ensuring that this large amount of data, collected from multiple systems, gets properly utilized across multiple disciplines that are relevant to the industry involved. The unique dilemmas of any given industry will require engineering expertise to address these specific challenges.

Augmented, Virtual, and Mixed Reality
New technologies are augmenting our reality. They are providing us with the ability to overlay digital content in front of us physically, merging the real with the virtual, creating a mixed reality that should be considered augmented. This gain is allowing engineers to view things in new ways. For example, rather than viewing a DT on a computer monitor, we could view a DT using an augmented reality (AR) headset that enables the users to engage with digital content or interact with holograms.

The use of such AR empowers viewers to have an immersive experience whereby they engage their bodily senses.

Reality-enhancing headsets can create real-time experiences of actual conditions happening in the physical world, by way of experiencing them through a digitized environment. AR could lead to new insights and understandings. Additionally, a DT display could appear in the user’s field of view, making real-time feedback that much more accessible and easy to use.

Artificial Intelligence Technologies
IIoT offers the promise to provide connected data; therefore, useful data must be stored and analyzed. Artificial intelligence (AI) is a solution to how to analyze and successfully handle large amounts of digital data. It helps in allowing digital twinning to become more realized because it promotes value by enabling rapid integration, hybrid integration, investment leverage, and system management and compliance.

Through machine learning, it offers the opportunity to use digital data to model, analyze, train, apply, and infer how best to make decisions. AI is helping to change the traditional perspective of computing, moving it beyond what primarily has been an automating- and scaling-process perspective towards a knowledgebased perspective, via actionable insights. Soon, it will help engineers gather new insights and ways to create value. By using a data-science approach, rapidly powered decisions will enable the generation of further opportunities.

Additive Manufacturing
Additive manufacturing (AM) is a method of production in which 3D objects are built by adding layer-upon-layer of material. AM holds promise because it leads to industries that can address variable demand and produce products that are distributable and flexible. Two areas of AM – 3D printing and digital thread – are advancing to make digital twinning possible.

(photo. Mouser Electronics)

3D Printing
3D printing is perhaps the most well-known example of AM. In 3D printing, a printer is programmed to print an object using plastics, metals, or other custom materials with virtually zero lead-time. 3D printing is extremely flexible and eliminates the issues involved in producing objects with large economies of scale. What this means for the future is that you will be able to get what you want quickly—as if walking up to the fast food counter.

Digital Thread
With complex systems, however, AM has been confined primarily to the laboratory because all the systems involved do not operate under a unified system and, thus, are hard to scale. Digital thread promises to change that.

A digital thread is a single, seamless strand of data that acts as the constant behind a data-driven digital system. It activates the potential of AM by allowing a unification of disparate applications by way of their adherence to the thread, which is their source of shared information. A digital thread creates an easier process for collecting, managing, and analyzing information from every location involved in the redesigned Industry 4.0. It enables better and more efficient design, production, and utilization throughout the entire process.

Conclusion
Digital twinning will be a hallmark of Industry 4.0, helping to increase gains, efficiencies, and flexibility for existing products and processes. But digital twinning is just one part of the Industry 4.0 road map. Pairing technologies, CPS, AI, and AM are key to seamlessly bringing together the physical realm and the realm of its DT information and insights. While these technologies are bringing their complexities into the digital twinning equation, ultimately, they promise to enable Industry 4.0 to manifest its potential.

by Paul Golata for Mouser Electronics

뉴스레터 구독하기

아이씨엔매거진은 AIoT, IIoT 및 Digital Twin을 통한 제조업 디지털전환 애널리틱스를 제공합니다.
테크리포트: 스마트제조, 전력전자, 모빌리티, 로보틱스, 스마트농업

AW2026 expo
ACHEMA 2027
우청 기자
우청 기자http://icnweb.co.kr
아이씨엔 매거진 테크니컬 에디터입니다. 산업용사물인터넷과 디지털전환을 위한 애널리틱스를 모아서 뉴스와 기술기사로 제공합니다.
fastech EtherCAT
as-interface

Related Articles

World Events

Stay Connected

440FansLike
407FollowersFollow
224FollowersFollow
120FollowersFollow
372FollowersFollow
152SubscribersSubscribe
spot_img
spot_img
spot_img
automotion
InterBattery
Power Electronics Mag

Latest Articles

Related Articles

PENGUIN Solutions
NVIDIA GTC AI Conference
AW2026 expo

Related Articles

fastech EtherCAT
as-interface
ST마이크로, 극한의 전압 변동에도 안정적인 자동차용 지능형 하이사이드 드라이버 출시

ST마이크로, 극한의 전압 변동에도 안정적인 자동차용 지능형 하이사이드 드라이버 출시

0
ST마이크로일렉트로닉스가 겨울철 시동 시 전압이 급격히 떨어지는 상황에서도 자동차 전자기기를 안전하게 보호하고 전원을 안정적으로 공급하는 똑똑한 전력 제어 칩을 선보이며 차세대 차량용 반도체 시장 공략에 박차를 가하고 있다
노르딕 세미컨덕터, 알리로 및 매터 기반 출입 제어용 레퍼런스 디자인 공개

노르딕 세미컨덕터, 알리로 및 매터 기반 출입 제어용 레퍼런스 디자인 공개

0
노르딕이 스마트폰으로 문을 여는 기술인 ‘알리로’와 스마트홈 표준 ‘매터’를 동시에 지원하는 설계 도구를 발표했다. 이를 통해 제조사들은 보안성이 높고 기기 간 호환이 잘 되는 차세대 디지털 키 제품을 더 쉽고 빠르게 개발할 수 있다
ST마이크로, 혁신적 위상변이 제어 IC로 공진형 컨버터 효율 극대화

ST마이크로, 혁신적 위상변이 제어 IC로 공진형 컨버터 효율 극대화

0
ST가 전기를 더 효율적으로 사용하게 해주는 똑똑한 반도체 칩을 내놓았다. 이 칩은 스마트폰 충전기부터 대형 TV 전원까지 다양하게 쓰이며, 특히 LED 조명이 깜빡이지 않게 조절하는 능력이 뛰어나다
차세대 인터페이스 검증의 열쇠… 키사이트 인피니움 XR8

차세대 인터페이스 검증의 열쇠… 키사이트 인피니움 XR8

0
I 반도체의 성능이 높아질수록 미세한 신호 오류를 잡아내는 것이 중요해지는 가운데, 키사이트의 신형 오실로스코프는 초정밀 하드웨어와 '인피니움 2026' 소프트웨어를 결합해 차세대 반도체 개발 속도를 획기적으로 높여준다
에이디링크, 글로벌 규격 인증 통합 IAP·EVP 플랫폼 출시

에이디링크, 글로벌 규격 인증 통합 IAP·EVP 플랫폼 출시

0
글로벌 산업용 컴퓨터 기업 에이디링크가 전 세계 어디서든 별도의 복잡한 승인 절차 없이 바로 사용할 수 있는 신형 컴퓨터 시리즈를 출시했다. 성능은 높이면서도 각국의 안전 인증을 미리 받아두어 해외로 기계를 수출하는 기업들의 고민을 해결해 준다
마우저, NXP i.MX 91 프로세서 공급으로 IoT·엣지 애플리케이션 확대 지원

마우저, NXP i.MX 91 프로세서 공급으로 IoT·엣지 애플리케이션 확대 지원

0
NXP 반도체의 에너지 효율적인 i.MX 91 시스템온칩(SoC)은 진화하는 프로토콜과 새로운 표준에 대응할 수 있는 뛰어난 성능과 보안 기능을 갖춘 경제적인 솔루션이다
- Our Youtube Channel -Engineers Youtube Channel

Latest Articles