Soitec is armed with engineered substrates for 5G

Soitec, a specialist in designing and manufacturing innovative semiconductor materials, announced the availability on its website of a new presentation focused on engineered substrates for 5G markets and applications.

Paul Boudre, Soitec’s CEO, commented: “Since the beginning of 5G, Soitec has been working on its development with the RF ecosystem. Today, with 5G’s ongoing global deployment, we are willing to share our vision with our day-to-day partners. Soitec is answering current and future customers’ needs through a comprehensive portfolio of engineered substrates that is geared to support their growth.”

On the ground of proven and differentiated technologies such as RF-SOI (which has become a standard for smartphones’ front-end modules), Soitec will benefit from the anticipated footprint expansion of FD-SOI, Piezo-on-insulator (POI), Gallium Nitride (GaN) and Silicon Photonics within smartphones and base stations.

The presentation referred to is available from the investors section of Soitec’s website:
https://www.soitec.com/en/investors/investors-material

Agenda

Fourth quarter FY’20 sales are due to be published on April 22nd, 2020 after market close.