BMW has introduced "Physical AI" through humanoid robots in its German factory, creating a safer and more efficient workplace where humans and robots collaborate.
Robotics leader NEURA and chip giant Qualcomm joined forces to unveil advanced AI technology that allows humanoid robots to think and react instantly, accelerating the era of safe human-robot collaboration in homes and factories.
Endress+Hauser’s acquisition of SOPAT revolutionizes process analytical technology by integrating hybrid in-line sensing to enable real-time, zero-sample particle control and industrial-scale optimization.
Preparing for the AGI era arriving in 2026, Elon Musk identifies the combination of solar power and energy storage systems (ESS) as the sole rapid solution to the surging power demands of data centers, urgently calling for an acceleration in energy infrastructure development.
ams introduced a family of infrared VCSEL (Vertical-Cavity Surface-Emitting Laser) flood illuminators which help industrial manufacturers to develop new and innovative applications for robots, cobots, autonomous guided vehicles, and smart devices which perform 2D and 3D optical sensing.
New additions to the LoRa Core portfolio are a gateway baseband processor integrated with LoRa (SX1303) and an associated LoRa Corecell gateway reference design that supports the fine timestamp feature.
Soracom announced a new flat rate pricing plan that allows companies deploying IoT solutions in the U.S. and Canada to reduce overall connectivity costs 30 percent to 60 percent over other IoT connectivity providers.
Celera Motion, a specialist in precision motion component and sub-system solutions and a business unit of Novanta Corporation added Aura Absolute Chip Encoder Series to its line of precision rotary and linear optical encoders with MicroE technology.
Plus signed a strategic customer agreement with Ouster which will provide its digital LiDAR sensors to outfit key elements of Plus’s automated truck system.
HARDSIL® immunizes semiconductor devices against high temperature or radiation induced stresses without the need for special design techniques (RHBD) or expensive specialized semiconductor processes (RHBP).
II‐VI announced its double-junction vertical cavity surface-emitting laser (VCSEL) arrays, the first of its multi-junction VCSEL array platforms for next-generation world-facing 3D sensing applications.