BMW has introduced "Physical AI" through humanoid robots in its German factory, creating a safer and more efficient workplace where humans and robots collaborate.
Robotics leader NEURA and chip giant Qualcomm joined forces to unveil advanced AI technology that allows humanoid robots to think and react instantly, accelerating the era of safe human-robot collaboration in homes and factories.
Endress+Hauser’s acquisition of SOPAT revolutionizes process analytical technology by integrating hybrid in-line sensing to enable real-time, zero-sample particle control and industrial-scale optimization.
Preparing for the AGI era arriving in 2026, Elon Musk identifies the combination of solar power and energy storage systems (ESS) as the sole rapid solution to the surging power demands of data centers, urgently calling for an acceleration in energy infrastructure development.
Nexa3D announced it has expanded its partnership with Henkel to immediately deliver three new performance photopolymer materials through its expanding Nexa3D channels globally
Petasense, a specialist in IIoT sensors and asset reliability and optimization, launched the first industrial wired sensor that combines vibration, temperature and speed detection into a single sensor.
IOhub is the ICS data management solution that will completely revolutionize the way companies manage and handle data coming from industrial machines. EZ VPN created a flexible and simple solution to manage machine data that can be implemented without any specific IT knowledge by adding application as you would do with your cellphone.
VIAVI's patented optical filters achieve superior optical performance, a desired reduction in filter thickness, and a reduced center wavelength shift with a change in incidence angle of the reflected light.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®320 D2W die preparation and activation system—the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer (D2W) bonding.
A technology partnership between an automotive LiDAR specialist Ibeo Automotive Systems and SICK has resulted in a 3D solid-state LiDAR sensor for industrial applications.
Optomec announced a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products.