EtherCAT Semiconductor Working Group celebrates 10 years of success in chip manufacturing
Recently, the 20th meeting of the Semiconductor Technical Working Group of the EtherCAT Technology Group (ETG), the so-called TWG Semi, took place.
The next steps in PROFINET Security integration
Industry 4.0 applications live off of connectivity and the exchange of data between the IT and OT levels. This makes it possible to create new business models and increase productivity, with plant and data security naturally taking center stage.
Arrow Electronics camera modules enable plug-and-play addition of vision capabilities to extensive range of embedded applications
Arrow Electronics has introduced a family of plug-and-play camera modules based on sensor technology from onsemi™. The modules provide original equipment manufacturers with a simple and cost-effective path to incorporating a wide range of camera functionalities in their products.
OPC Foundation’s Field Level Communications Initiative reaches significant milestone and celebrates premiere
The OPC Foundation’s Field Level Communications (FLC) initiative has completed the second release candidate of the OPC UA FX (Field eXchange) specifications and has started the review and release process for them.
OPC Foundation and CESMII launches the UA Cloud Library
OPC Foundation announced the launch of the globally available UA Cloud Library co-developed with the Clean Energy and Smart Manufacturing Innovation Institute (CESMII).
Molex acquires Keyssa to board-to-board contactless connectivity
Molex, a global electronics leader and connectivity innovator, has acquired core technology and intellectual property (IP) from Keyssa Inc., a pioneer in high-speed contactless connectors.
[테마] 공정산업을 위한 이더넷-APL의 10가지 혜택
이더넷-APL(Ethernet-APL; advanced physical layer) 기술은 위험한 지역에 설치되는 공정자동화 시설에 고속 이더넷 지원 계측기기를 배치하여 막대한 장벽을 일시에 해결한다. 이더넷-APL은 통신속도, 방폭 영역에 도달, 현장 계측 및 1,000m의 장거리 케이블을 포설하여
