2026년 4월 1일, 수요일
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Industry News

BMW Leipzig Factory Redefines Manufacturing with ‘Physical AI’ and Humanoid Robots

BMW has introduced "Physical AI" through humanoid robots in its German factory, creating a safer and more efficient workplace where humans and robots collaborate.

NEURA Robotics and Qualcomm Form Strategic Collaboration to Accelerate ‘Physical AI’ and ‘Cognitive Robotics’

Robotics leader NEURA and chip giant Qualcomm joined forces to unveil advanced AI technology that allows humanoid robots to think and react instantly, accelerating the era of safe human-robot collaboration in homes and factories.

Giving Eyes to Process Automation: Endress+Hauser Revolutionizes PAT with SOPAT Acquisition

Endress+Hauser’s acquisition of SOPAT revolutionizes process analytical technology by integrating hybrid in-line sensing to enable real-time, zero-sample particle control and industrial-scale optimization.

Musk’s 2026 Warning and Proposal: “The Key to AGI Lies Not in Chips, But in the ‘Sun'”

Preparing for the AGI era arriving in 2026, Elon Musk identifies the combination of solar power and energy storage systems (ESS) as the sole rapid solution to the surging power demands of data centers, urgently calling for an acceleration in energy infrastructure development.

Hyundai Motor Shifts Robotics Strategy From Lab Stunts to Factory Floor Realities

Commercial-scale AI robotics deployment by 2026. All-electric architecture with 360-degree joint mobility. Software-Defined Factory (SDF) as a data-learning hub.

Highest sales in the company’s history – HARTING Technology Group heads for a climate-neutral future with record investment

Despite the challenges posed by the ongoing global coronavirus pandemic, fragile supply chains and supply bottlenecks, the HARTING Technology Group, based in Espelkamp in the Minden-Lübbecke district, continued on its path of growth in the 2020/21 business year

EtherCAT Semiconductor Working Group celebrates 10 years of success in chip manufacturing

Recently, the 20th meeting of the Semiconductor Technical Working Group of the EtherCAT Technology Group (ETG), the so-called TWG Semi, took place.

The next steps in PROFINET Security integration

Industry 4.0 applications live off of connectivity and the exchange of data between the IT and OT levels. This makes it possible to create new business models and increase productivity, with plant and data security naturally taking center stage.

Arrow Electronics camera modules enable plug-and-play addition of vision capabilities to extensive range of embedded applications

Arrow Electronics has introduced a family of plug-and-play camera modules based on sensor technology from onsemi™. The modules provide original equipment manufacturers with a simple and cost-effective path to incorporating a wide range of camera functionalities in their products.

OPC Foundation’s Field Level Communications Initiative reaches significant milestone and celebrates premiere

The OPC Foundation’s Field Level Communications (FLC) initiative has completed the second release candidate of the OPC UA FX (Field eXchange) specifications and has started the review and release process for them.

OPC Foundation and CESMII launches the UA Cloud Library

OPC Foundation announced the launch of the globally available UA Cloud Library co-developed with the Clean Energy and Smart Manufacturing Innovation Institute (CESMII).
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