2026년 3월 23일, 월요일
식민지역사박물관
aw 2026

Single common conformance test plan to be available for IEC/IEEE 60802 TSN profile for Industrial Automation

The focus of the collaboration is to work together towards a jointly agreed and owned test plan for the industrial automation market

Single common conformance test plan to be available for IEC/IEEE 60802 TSN profile for Industrial Automation
the TSN Industrial Automation Conformance Collaboration(TIACC)

The Avnu Alliance, CC-Link Partner Association, ODVA, OPC Foundation, and PROFIBUS & PROFINET International jointly announce that they are collaborating to develop a single conformance test plan for the IEEE/IEC 60802 Time Sensitive Networking (TSN) profile for Industrial Automation.

The test plan will be used as a base test by all the participating organizations and made available to the broader Industrial Automation ecosystem. This collaboration contributes towards end user confidence that 60802 conformant devices from different manufacturers which support different automation protocols will coexist reliably at the TSN level on shared networks, including with devices using TSN for applications other than automation.

The focus of the collaboration is to work together towards a jointly agreed and owned test plan for the industrial automation market. This formal collaboration provides value by creating a structure in which all these organizations can work together and exchange ideas towards the end goal of interoperability and coexistence on open, standard networks for all protocols, without needing to establish a separate, formal organization. For convenience, the collaboration activities will be referred to as “TIACC” (TSN Industrial Automation Conformance Collaboration).

The TIACC marks a commitment by these organizations to develop an interoperable ecosystem of devices from different manufacturers to comply with the IEC/IEEE Standards Association 60802 profile and enable end-users to confidently deploy these devices on open, standard networks. The goal is to have the final version of the single, shared test plan available soon after the IEC/IEEE 60802 profile is published.

TSN Common Test Plan People
Dr. Al Beydoun (President and Executive Director of ODVA), Greg Schlechter (President Avnu Allianz), Manabu Hamaguchi (Global Director of CLPA), Stefan Hoppe (President and Executive Director of OPC Foundation) and Karsten Schneider (CEO of Profibus and Profinet International)(from left to right).

“Avnu’s purpose and mission is to transform standard networks to enable support for many time sensitive applications and protocols in an open, interoperable manner. This collaboration among organizations will be critically important to facilitating coexistence of multiple workloads and protocols according to IEEE 60802 on a network, while leveraging foundational network interoperability that is used across industries,” said Greg Schlechter, Avnu Alliance President. “We are committed to working with the industries to enable an interoperable ecosystem of devices that allow end users to confidently deploy on open, standard, and converged networks.”

“The creation of the Connected Industries of the future requires different systems and devices to communicate in order to deliver the necessary process transparency required. This is a core principle for the CLPA and is at the root of why the organization was founded. This is why we are delighted to be part of the TIACC and look forward to supporting the creation of a unified, common test plan for TSN-compatible products. By doing so, we can help further boost the adoption of futureproof technologies for smart manufacturing,” said Manabu Hamaguchi, Global Director at CLPA.

The TIACC marks a commitment by these organizations to develop an interoperable ecosystem of devices from different manufacturers to comply with the IEC/IEEE Standards Association 60802 profile and enable end-users to confidently deploy these devices on open, standard networks.

“EtherNet/IP users will be able to take advantage of the benefits afforded by 60802 TSN of enhanced network performance, higher utilization, and guaranteed network access for multiple time-critical applications with different priorities. ODVA’s participation in TIACC will ensure that the full potential of 60802 TSN coexistence is realized by end users to help make Industry 4.0 and IIoT a reality,” said Dr. Al Beydoun, President and Executive Director at ODVA.

“OPC UA is a secure, vendor-independent communication solution that fully scales from the field to the cloud and offers semantic interoperability. Other underlying IT infrastructure such as Ethernet TSN and the IEC/IEEE 60802 TSN Profile for Industrial Automation open up further applications for the market. We believe this conformance collaboration is an important contribution to preparing and delivering streamlined and effective conformance testing and certification to the industry in collaboration with other SDOs,” said Stefan Hoppe, President and Executive Director of the OPC Foundation.

“At PI we are taking conformance testing very seriously. It’s our belief, that thought-out testing ensures cross-vendor interoperability. That’s why we invested huge efforts in our test system in recent years. With this joint initiative we are taking the next step towards converged networks utilizing TSN, giving our users the confidence in the future-readiness of PROFINET. This collaboration is a huge milestone on the way of the digital transformation,” said Karsten Schneider, Chairperson of PROFIBUS and PROFINET International (PI).

Learn more about the TSN Industrial Automation Conformance Collaboration #TIACC here: www.tiacc.net

Avnu
Avnu Alliance is a community creating an interoperable ecosystem servicing the precise timing and low latency requirements of diverse applications using open standards through certification. The Alliance, in conjunction with other complimentary standards bodies and alliances, provides a united network foundation for use in professional AV, automotive, industrial control and consumer segments. To learn more about Avnu Alliance, visit www.avnu.org.

For more information, contact:
PR@avnu.org

CC-Link Partner Association
For more than 20 years, the CC-Link Partner Association has been a global organization dedicated to the development of the CC-Link family of open automation networks. These are high-speed, high-performance open industrial network technologies that enable devices from numerous manufacturers to communicate resulting in fast, deterministic control systems. The CLPA’s key technology is CC-Link IE TSN, the world’s first open industrial Ethernet to combine gigabit bandwidth with Time-Sensitive Networking (TSN). Currently the CLPA has over 4,000 member companies globally and 2,500 compatible products available from 360 manufacturers. 30 million devices using CLPA technologies are in use worldwide. For more information, please visit https://www.cc-link.org/.

For more information, contact:
Satoshi Kawana
Kawana.Satoshi@cc-link.org

ODVA
ODVA is an international standards development and trade organization with members from the world’s leading automation suppliers. ODVA’s mission is to advance open, interoperable information and communication technologies for industrial automation. Its standards include the Common Industrial Protocol or “CIP™,” ODVA’s media independent network protocol – and industrial communication technologies including EtherNet/IP, DeviceNet and others. For interoperability of production systems and their integration with other systems, ODVA embraces the adoption of commercial-off-the-shelf, standard Internet and Ethernet technologies as a guiding principle. This principle is exemplified by EtherNet/IP – today’s leading industrial Ethernet network. Visit ODVA online at www.odva.org.

For more information, contact:
Steve Fales
sfales@odva.org

OPC Foundation
Since 1996, the OPC Foundation has facilitated the development and adoption of the OPC information exchange standards. As both advocate and custodian of these specifications, the Foundation’s mission is to help industry vendors, end-users, and software developers maintain interoperability in their manufacturing and automation assets. The OPC Foundation is dedicated to providing the best specifications, technology, process, and certification to achieve multivendor, multiplatform, secure, reliable, interoperability for moving data and information from the embedded world to the enterprise cloud. The Foundation serves over 860 members worldwide in the Industrial Automation, IT, IoT, IIoT, M2M, Industrie 4.0, Building Automation, machine tools, pharmaceutical, petrochemical, and Smart Energy sectors. For more information about the OPC Foundation, please visit www.opcfoundation.org.

For more information, contact:
Stefan Hoppe
Stefan.Hoppe@OPCFoundation.org

PROFIBUS & PROFINET International (PI)
PI is a wide spread automation community in the world represented by 25 different Regional PI Associations and is responsible for PROFIBUS and PROFINET, the two leading industrial communications protocols covering all industries. The common interest of PI’s global network of vendors, developers, system integrators and end users lies in promoting, supporting and using PROFIBUS and PROFINET. Regionally and globally over 1,500 member companies are working closely together around the world to the best automation possible. The organization’s global influence and reach is unmatched in the world of automation. For more information, please visit the website at www.profibus.com.

For more information, contact:
Barbara Weber
Barbara.Weber@profibus.com

뉴스레터 구독하기

아이씨엔매거진은 AIoT, IIoT 및 피지컬 AI, 디지털트윈을 통한 제조업 디지털전환 애널리틱스를 제공합니다.
테크리포트: 자율제조, 전력전자, 모빌리티, 로보틱스, 스마트농업

AW2026 expo
ACHEMA 2027
우청 기자
우청 기자http://icnweb.co.kr
아이씨엔 매거진 테크니컬 에디터입니다. 산업용사물인터넷과 디지털전환을 위한 애널리틱스를 모아서 뉴스와 기술기사로 제공합니다.
fastech EtherCAT
as-interface

Related Articles

Stay Connected

440FansLike
407FollowersFollow
224FollowersFollow
120FollowersFollow
372FollowersFollow
152SubscribersSubscribe
spot_img
InterPACK
spot_img
SPS 2026
automotion
Power Electronics Mag

Latest Articles

Related Articles

PENGUIN Solutions
WindEnergy
InterPACK

Related Articles

fastech EtherCAT
as-interface
노르딕, nRF54L로 엣지 AI 주도권 확보… “배터리 기기에 인텔리전스 심는다”

노르딕, nRF54L로 엣지 AI 주도권 확보… “배터리 기기에 인텔리전스 심는다”

0
노르딕 세미컨덕터가 배터리 소모는 줄이고 인공지능 속도는 15배 높인 신개념 AI 칩 nRF54LM20B를 출시하며 스마트폰 없이도 똑똑하게 작동하는 웨어러블 및 IoT 기기 시대를 앞당기고 있다
에이디링크, 차세대 PXIe 플랫폼으로 반도체 테스트 시장 정조준

에이디링크, 차세대 PXIe 플랫폼으로 반도체 테스트 시장 정조준

0
에이디링크가 반도체와 전자 부품을 더 정밀하고 빠르게 검사할 수 있는 새로운 장비와 조립형 플랫폼을 출시하여 제조 공정의 효율을 높였다.
노르딕, 엔트리급 nRF54L 시리즈 확장… IoT 기기 가격 경쟁력 높인다

노르딕, 엔트리급 nRF54L 시리즈 확장… IoT 기기 가격 경쟁력 높인다

0
노르딕 세미컨덕터가 성능은 높이고 가격 부담은 낮춘 새로운 블루투스 칩 nRF54LS05 시리즈를 공개하며 스마트 태그와 센서 등 소형 IoT 기기의 대중화를 이끌고 있다
1달러의 마법? TI, TinyEngine NPU로 엣지 AI 장벽 허문다

1달러의 마법? TI, TinyEngine NPU로 엣지 AI 장벽 허문다

0
TI가 단돈 1달러로 고성능 AI 기능을 구현하는 TinyEngine NPU 기반 반도체를 공개하며 로봇, 가전 등 모든 기기가 스스로 판단하는 엣지 AI 시대를 열고 있다
인텔, 데스크톱 성능의 정점 코어 Ultra 200S 플러스 시리즈 전격 출시

인텔, 데스크톱 성능의 정점 코어 Ultra 200S 플러스 시리즈 전격 출시

0
인텔이 코어 Ultra 200S 플러스 시리즈를 출시하여 게임 속도는 더 빠르게, 영상 편집 등의 전문 작업 성능은 최대 2배까지 높였다
NXP, 차량 제조 혁신 앞당길 코어라이드 Z248 구역 레퍼런스 시스템 공개

NXP, 차량 제조 혁신 앞당길 코어라이드 Z248 구역 레퍼런스 시스템 공개

0
NXP가 자동차 제조사들이 차세대 전기차를 더 빠르고 안전하게 만들 수 있도록 전력 관리와 데이터 처리가 합쳐진 통합 설계 시스템을 출시했다
- Our Youtube Channel -Engineers Youtube Channel

Latest Articles