2026년 4월 11일, 토요일
식민지역사박물관
B&R
#하노버메세

Microchip Announces Industry’s First Space-Qualified COTS-Based Radiation-Tolerant Ethernet Transceiver

Radiation-qualified devices enable expanded Ethernet connectivity for space applications

Microchip Announces Industry’s First Space-Qualified COTS-Based Radiation-Tolerant Ethernet Transceiver
Space Application

Ethernet is becoming more common in spacecraft to enable hardwired communication speed, support higher data rates, and facilitate interoperability between satellites and other spacecraft. As Ethernet in space applications continues to expand, Microchip Technology Inc. (Nasdaq: MCHP) has announced the industry’s first space-qualified Ethernet transceiver – a radiation-tolerant device based on a Commercial Off-the-Shelf (COTS) solution widely deployed in other industries now offering reliable performance for applications ranging from launch vehicles to satellite constellations and space stations.

In addition to Microchip’s new VSC8541RT radiation-tolerant Ethernet transceiver sampling, the company received final qualification for the new SAM3X8ERT radiation-tolerant microcontroller, its latest Arm® Cortex®-M3 core processor and embedded Ethernet controller. These are designed to support space industry demand for radiation tolerant devices separately or in combination.

Both devices are COTS-based parts with enhanced characterized levels of radiation performance and high reliability quality flow, available in plastic and ceramic packages. They share the same pin-out distribution, allowing designers to begin implementation with COTS devices before moving to space-grade components. This significantly reduces development time and cost.

“As the first to provide both a rad-tolerant transceiver and an enhanced rad-tolerant microcontroller for the rapidly-expanding, high-reliability Ethernet market, Microchip continues to support space industry developments and evolution with qualified and proven solutions,” said Bob Vampola, associate vice president of Microchip’s aerospace and defense group. “Microchip’s COTS-based space-grade processing provides the right performance and the right level of qualification to meet evolving requirements from Low-Earth Orbit constellations to deep space missions.”

These latest devices are among Microchip’s broad suite of COTS-based radiation tolerant microelectronics supporting Ethernet connectivity to be used aboard satellite platforms, payloads for data and sensor bus control, remote terminal communication, space vehicle networks, and module connectivity in space stations.

The VSC8541RT transceiver is a single-port Gigabit Ethernet copper PHY with GMII, RGMII, MII and RMII interfaces. Radiation performances have been verified and documented in detailed reporting. The VSC8541RT is latch-up immune up to 78 Mev; TID has been tested up to 100 Krad. With the same rad-tolerant die and package, a 100 MB limited bitrate performance VSC8540RT is also available in plastic and ceramic qualified versions, which provides performance and cost scalability for targeted missions.

The SAM3X8ERT radiation-tolerant MCU implements on a System on Chip (SoC) with the widely-deployed Arm® Cortex®-M3 core processor, delivering 100 DMIPS benefits from the same ecosystem as the industrial variant. The SAM3X8ERT contributes to the system integration trend helping to drive the space industry toward more advanced technologies. This microcontroller embeds up to 512 Kbytes Dual Bank Flash, 100 Kbytes SRAM, ADC & DAC and dual CAN controller on top of Ethernet capability.

These latest devices complement Microchip’s suite of radiation-tolerant and radiation-hardened hardware processing solutions. With the SAMV71Q21RT Arm® M7 MCU up 600DMIPS and ATmegaS128/64M1 8-bit MCU series, all share the same development tools.

Development Tools

To support the design process and accelerate time to market, developers can use the Arduino Due commercial kit for the SAM3X8ERT along with the VSC8541EV evaluation boards for the VSC8541RT. The SAM3X8ERT device is supported by Atmel Studio Integrated Development Environment for developing, debugging and software libraries.

Availability

The VSC8541RT in plastic or ceramic package is sampling today, and the SAM3X8ERT qualified devices are available today in production quantities. The SAM3X8ERT comes in ceramic prototype to space grade ceramic and high reliability plastic packages. The VSC8541RT comes in ceramic prototype to space grade ceramic and high reliability plastic packages. These range from QFP144 packages for SAM3X8ERT to CQFP68 packages for VSC854xRT. Complete product information is at www.microchip.com.

뉴스레터 구독하기

아이씨엔매거진은 AIoT, IIoT 및 피지컬 AI, 디지털트윈을 통한 제조업 디지털전환 애널리틱스를 제공합니다.
테크리포트: 자율제조, 전력전자, 모빌리티, 로보틱스, 스마트농업

AW2026 expo
ACHEMA 2027
오승모 기자
오승모 기자http://icnweb.kr
기술로 이야기를 만드는 "테크 스토리텔러". 아이씨엔 미래기술센터 수석연구위원이며, 아이씨엔매거진 편집장을 맡고 있습니다. 디지털 전환을 위한 데이터에 기반한 혁신 기술들을 국내 엔지니어들에게 쉽게 전파하는데 노력하는 중입니다.
fastech EtherCAT
as-interface

Related Articles

Stay Connected

440FansLike
407FollowersFollow
224FollowersFollow
120FollowersFollow
372FollowersFollow
152SubscribersSubscribe
spot_img
InterPACK
spot_img
SPS 2026
automotion
Power Electronics Mag

Latest Articles

Related Articles

PENGUIN Solutions
구글, 엣지 AI 혁신 이끌 ‘젬마 4’ 공개… 온디바이스 추론 성능 극대화

구글, 엣지 AI 혁신 이끌 ‘젬마 4’ 공개… 온디바이스 추론 성능...

0
구글이 인터넷 연결 없이도 스마트폰이나 소형 산업용 컴퓨터에서 빠르게 작동하는 인공지능 '젬마 4'를 공개했다. 이 모델은 크기가 작으면서도 성능은 대형 AI 못지않아 공장의 기계 상태를 살피거나 로봇을 조종하는 데 유용하다
WindEnergy
InterPACK

Related Articles

fastech EtherCAT
as-interface
피닉스컨택트, 유지보수·보안성 강화한 실외용 스마트 이더넷 박스 출시

피닉스컨택트, 유지보수·보안성 강화한 실외용 스마트 이더넷 박스 출시

0
피닉스컨택트가 실외에서 사용하는 똑똑한 통신 상자인 스마트 이더넷 박스를 업그레이드했다. 가장 큰 장점은 고장이 났을 때 복잡한 광케이블을 다시 연결할 필요 없이 상자 본체만 갈아 끼울 수 있어 복구 시간이 매우 짧다는 것
[#HM24] HARTING, 미래 핵심인 전기에너지에 열정을 쏟다

[#HM24] HARTING, 미래 핵심인 전기에너지에 열정을 쏟다

0
HARTING은 2024 하노버 박람회에서 TECO 2030 연료 전지에 사용되는 연결 기술을 소개한다
[#HM24] 안전한 데이터 교환의 상생적 이점

[#HM24] 안전한 데이터 교환의 상생적 이점

0
Roseman Labs의 솔루션은 실제 데이터의 개인 정보와 상업적 민감성을 보존하면서 여러 데이터 세트를 암호화, 연결 및 분석할 수 있도록 한다
P+F, LiDAR와 MEMS 결합한 산업용 3D 센서 개발

P+F, LiDAR와 MEMS 결합한 산업용 3D 센서 개발

0
P+F와 프라운호퍼 연구소는 지난 4월말 독일에서 개최된 하노버산업박람회(Hannover Messe 2023)에서 LiDAR와 MEMS 기술을 결합해 개발한 R3000 3-D LiDAR/MEMS 센서에 대한 연구 사례를 발표했다.
[#HM24] 벡호프, AI 모델 생성을 간소화하는 AutoML 도구 출시

[#HM24] 벡호프, AI 모델 생성을 간소화하는 AutoML 도구 출시

0
AutoML은 규제 산업에서 설명 가능하고 재현 가능한 결과를 제공하는데 AI 솔루션을 제공한다는 유망한 전망을 제시하고 있다
- Our Youtube Channel -Engineers Youtube Channel

Latest Articles