EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®320 D2W die preparation and activation system—the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer (D2W) bonding.
Optomec announced a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products.
LMI Technologies (LMI) acquired FringeAI, an innovative AI and IIoT/5G inspection company which delivers a software suite that leverages integrated deep learning, dedicated edge devices, and IIoT/5G connected cloud services, to deliver AI-based solutions across many markets.
Nexa3D, the maker of ultrafast polymer production 3D printers, announced today the immediate availability of NexaX 2.0 software, a comprehensive file-to-part software platform that extends the 20X productivity advantage of its ultrafast NXE 400 3D printers.
