Viko Optics Technical enters into licensing agreement with VIAVI for 3D sensing filters
VIAVI's patented optical filters achieve superior optical performance, a desired reduction in filter thickness, and a reduced center wavelength shift with a change in incidence angle of the reflected light.
EV Group’s hybrid die-to-wafer bonding activation solution speeds up deployment of 3D heterogeneous integration
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®320 D2W die preparation and activation system—the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer (D2W) bonding.
Ibeo and SICK bring stimulus to industrial sector with new 3D solid-state LiDAR sensor
A technology partnership between an automotive LiDAR specialist Ibeo Automotive Systems and SICK has resulted in a 3D solid-state LiDAR sensor for industrial applications.
Optomec unveils 3D additive electronics printer for inline production
Optomec announced a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products.
Aeva deploys 4D LiDAR for TuSimple’s autonomous trucks
Aeva announced a partnership with TuSimple, a global self-driving technology company, to deploy Aeva 4D LiDAR on TuSimple’s self-driving trucks.
Microchip introduces industrial ethernet switches family for TSN
To help eliminate reliance on such sole-sourced, expensive and proprietary solutions for deterministic communications, Microchip Technology Inc. (Nasdaq: MCHP) announced its SparX-5i family of Ethernet switches – a single-chip, IEEE standards-based solution that offers the industry’s most complete TSN feature set.
Nexa3D delivers new Everlast Membrane to extend series production runs with less downtime
Nexa3D Everlast Membrane overcomes the constraints of currently practiced alternative membrane technologies including clouding, chemical instability and doming effects.
Agrowing and VetorGEO announce significant breakthrough in multispectral leaf-level and aerial HLB detection in Citrus
Agrowing, an Israeli world leading provider of award-winning AI-Enabling multispectral sensors, and Vetorgeo, a Brazilian startup focused on Agriculture 4.0 solutions, collaborating with São Paulo University (UNESP) announce a significant breakthrough in leaf-level and aerial HLB detection in Citrus.
