More

    high-performance TI Jacinto™ 7 processors enable mass-market adoption of automotive ADAS and gateway technology

    Highly integrated processors support the needs of your entire vehicle lineup with specialized accelerators and functional safety features on-chip and a unified software platform

    TI, Next-generation Jacinto 7 automotive processors
    TI, Next-generation Jacinto 7 automotive processors

    Texas Instruments (TI) (NASDAQ: TXN) today introduced the new Jacinto™ 7 processor platform. Built on the foundation of TI’s decades of automotive systems and functional safety expertise, the new Jacinto processor platform brings enhanced deep learning capabilities and advanced networking to solve design challenges in advanced driver assistance systems (ADAS) and automotive gateway applications.

    The first two automotive devices in the platform, TDA4VM processors for ADAS and DRA829V processors for gateway systems, include specialized on-chip accelerators to segment and expedite data-intensive tasks, like computer vision and deep learning. Additionally, TDA4VM and DRA829V processors incorporate a functional safety microcontroller, making it possible for original equipment manufacturers (OEMs) and Tier-1 suppliers to support both ASIL-D safety-critical tasks and convenience features with one chip. Both devices share a single software platform, which alleviates system complexity and cost by enabling developers to reuse their software investment across multiple vehicle domains. 

     

    Improving vehicle awareness within low power budgets
    Through in-bound camera, radar and LIDAR data, ADAS technology helps cars see and adapt to the world around them. The influx of information coming into the car underscores the need for processors or systems-on-chip to quickly and efficiently manage multilevel processing in real time, all while operating within the system’s power budget. TI’s new processors execute high-performance ADAS operations using just 5 to 20 W of power, eliminating the need for active cooling.

    The TDA4VM processor offers on-chip analytics combined with sensor pre-processing, enabling more efficient system performance. This allows OEMs and Tier-1 suppliers to support front camera applications using high-resolution 8-MP cameras to see farther and add enhanced features, such as drive assist. Additionally, TDA4VM processors are capable of simultaneously operating four to six 3MP cameras while also fusing other sensing modalities such as radar, LIDAR and ultrasonic on one chip. This multilevel capability enables TDA4VM to act as the centralized processor for ADAS and enables the critical features for automated parking, like surround view and image processing for displays, enhancing vehicle perception for 360 degrees of awareness.

    Accelerating the data highway for the software-defined car
    The DRA829V processor seamlessly integrates the computing functions required for modern vehicles. As vehicle technology advances, automotive gateways need a flexible processor to manage higher volumes of data and support evolving requirements for autonomy and enhanced connectivity. The DRA829V processor is the first in the industry to incorporate a PCIe switch on-chip in addition to integrating an eight-port gigabit TSN-enabled Ethernet switch for faster high-performance computing functions and communications throughout the car.

    Combined with the ability to support both ASIL-D safety-critical and non-safety-critical operations, these computing and communication features enable OEMs and Tier-1 suppliers to support mixed-criticality applications on one device. Higher bandwidth on-chip also allows developers to manage software development and validation in vehicles, which translates to more dynamic updates and upgrades.

    Availability and pricing
    Developers can get started immediately with Jacinto 7 processors development kits, and buy the new TDA4VMXEVM and DRA829VXEVM evaluation modules on TI.com for US$1,900 each. Preproduction TDA4VM and DRA8329V processors are available now, only from TI, at US$97 in 1,000-unit quantities. Volume production is expected to be available in the second half of 2020.

    아이씨엔매거진
    IO-Link Wireless
    오승모 기자
    오승모 기자http://icnweb.kr
    기술로 이야기를 만드는 "테크 스토리텔러". 아이씨엔 미래기술센터 수석연구위원이며, 아이씨엔매거진 편집장을 맡고 있습니다. 디지털 전환을 위한 데이터에 기반한 혁신 기술들을 국내 엔지니어들에게 쉽게 전파하는데 노력하는 중입니다.
    • AW2025
    • Mobile World Live
    • 파스텍 배너 900
    • hilscher
    ASI

    Join our Newsletter

    Get the latest newsletters on industry innovations.

    AW2025
    MWC
    오토모션
    Hannover messe
    embeddedworld 2025
    semicon 2025

    Related articles

    미국의 대중국 반도체 제재는 5G 통신에만 해당.. 전기차 업체들 최신 반도체 도입 확대 중

    래티스 반도체는 미국의 대중국 반도체 제제에도 전기차 등 산업에서 기술 도입이 활발하다고 밝혔다

    스바루 차세대 AI 아이사이트 시스템에 온세미 하이퍼럭스 센서 채택

    온세미가 스바루(Subaru)의 차세대 아이사이트(EyeSight) 스테레오 카메라 전면 센싱 시스템용 이미지 센서 주요 공급업체로 선정됐다

    보쉬, 교통 안전을 강화하는 실시간 도로 위험 경고 서비스 출시

    보쉬(Bosch)가 혁신적인 도로 위험 경고 서비스를 도입해 교통 안전을 크게 향상시켰다

    기자의 추가 기사

    IIoT

    오토모션
    파스텍 배너 300
    Hannover messe

    추천 기사

    mobility