More

    InspireSemi sets new standard of compute power, energy efficiency & flexibility for AI and other applications

    Inspire Semiconductor announced the development of its second-generation ASIC solution for Artificial Intelligence (AI), Blockchain and Scientific High Performance Computing.

    InspireSemi spun out of CryptoCore Intellectual Holdings, which also provided seed funding, and is dedicated to delivering superior computation solutions for AI and other compute intensive industries. Its Gen1 ASIC chip is already a powerful performer in the crypto mining space.

    “We couldn’t be more pleased with the results of our Gen1 solution,” said InspireSemi Founder and President, Alex Gray. “Gen2 will build on Gen1 with a more versatile architecture that integrates with established software ecosystems and sets new standards in performance and power efficiency.”

    InspireSemi’s versatile processor architecture is based on an array of thousands of simple but powerful CPU cores, tightly integrated with memory and networking. Evolved for ultra-efficient blockchain applications, it is also an ideal platform for high-performance machine learning and scientific computing.

    The highly optimized, proprietary on-chip network removes crucial bottlenecks from applications that depend on close cooperation between many processors. Seamless arrays of hundreds of chips can be constructed, approaching one million cores.

    Compared to a modern datacenter GPU, the InspireSemi system provides all the raw computational power with greater flexibility and agility. The advanced network fabric enables better cooperation between cores with low latency and extreme bandwidth. The company’s roots in power and cost-sensitive blockchain computing enable InspireSemi to provide this performance with greater efficiency than leading GPUs.

    InspireSemi delivers a turn-key compute system including its proprietary power delivery and liquid cooling solutions.

    “Gen2, by design, will be capable of providing solutions for a far broader range of verticals than Gen1,” said InspireSemi Chief Financial Officer, John B. Kennedy. “Currently, we’re focusing on dynamic markets that are in need of extreme compute power, energy efficiency and affordability.”

    아이씨엔매거진

     

    IO-Link Wireless
    Hordon Kim
    Hordon Kimhttps://powerelectronics.co.kr
    아이씨엔매거진, PEMK(Power Electronics Magazine Korea) 인터내셔널 에디터입니다. An international editor of ICN magazine and PEMK.
    • Mobile World Live
    • AW2025
    • 파스텍 배너 900
    • hilscher
    ASI

    Join our Newsletter

    Get the latest newsletters on industry innovations.

    AW2025
    MWC
    오토모션
    semicon 2025
    Hannover messe
    embeddedworld 2025

    Related articles

    몰렉스, 업계 최초의 칩투칩 224G 제품 출시.. 차세대 AI 애플리케이션 지원 가속화

    몰렉스가 차세대 케이블, 백플레인, 보드 투 보드 커넥터, 최대 224Gbps-PAM4의 속도로 작동하는 near-ASIC 커넥터투케이블 솔루션을 비롯한 업계 최초의 칩투칩 224G 제품 포트폴리오를 출시했다

    인피니언, 작은 패키지로 낮은 전력 소모의 PDM 마이크로폰 출시

    인피니언은 자사의 XENSIV™ MEMS 마이크로폰 제품 포트폴리오에 작은 패키지로 낮은 전력 소모를 제공하는 새로운 초저전력 디지털 마이크로폰 IM69D128S를 추가한다

    CEVA, 5G RAN 주문형 반도체용 베이스밴드 플랫폼 IP 출시

    CEVA가 업계 최초의 ASIC용 5G 베이스밴드 플랫폼 IP PentaG-RAN™을 발표했다. PentaG-RAN™은 스몰셀에서 mMIMO에 이르는 분산장치(DU) 및 원격무선장치를 포함해 베이스 스테이션과 무선 구성에서 모두 셀룰러 인프라를 대상으로 한다.

    기자의 추가 기사

    IIoT

    파스텍 배너 300
    오토모션
    Hannover messe

    추천 기사

    mobility