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CeMAT: VDMA, Intralogistics sector on growth course

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The CeMAT has opened. Starting today Tuesday around 1,000 exhibitors at the leading global trade fair in Hannover present their innovations and solutions in the area of intralogistics and supply chain management. Punctually with the trade fair start, the VDMA Materials Handling and Intralogistics Association is pleased to announce positive business developments.

The German manufacturers of materials handling and intralogistics solutions recorded a good overall start into 2016. In first quarter 2016 the sector booked 4.1 percent more orders in a year-on-year comparison. “There were strong impulses here from Germany as well as the European single market. As things stand today, we can confirm the growth of 3 percent predicted for 2016,” explains Sascha Schmel, Managing Director VDMA Materials Handling and Intralogistics Association.

CeMAT

World export champion title remains in Germany
The sector enjoys a high export share. In 2015 German manufacturers exported products and solutions worth € 13.8 bn., 5 percent more than in 2014. So Germany retains its world export champion title in materials handling and intralogistics. And the sector’s global export volume also grew strongly again in 2015 – by 6 percent to an estimated € 75.4 bn.

International and networked
The exhibitors from 44 countries also expect that the trade fair public will be just as international. Under the keynote theme “Smart Supply Chain Solutions” the trade exhibition this year will be focussing on intelligent networking. “Hardly anything else has changed intralogistics over the past few years as much as the Internet. The increasing digitalisation changes products and business models alike. I am very happy that at the CeMAT we are certainly going to see numerous networked or automated solutions and concepts for all areas of application,” says Sascha Schmel.

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Faster time-to-market with a digital twin

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Faster time-to-market with a digital twin

New machines for the innovation-driven electronics industry have to be developed and put into operation very quickly. Chinese company Bozhon has joined forces with Siemens to do just that.

Streaming the latest episode of your favorite TV series on the train is no longer a vision of the future, it’s a daily reality. The latest apparel, books, or even food: Today nearly everything can be purchased with a tap of your finger on your smartphone. Consumers expect new products to be delivered at once, to be of the highest quality, and include the most recent technology. That goes for smartphones, too: users expect them to constantly have the very latest technology, and frequently buy a new replacement model after just a short period of time.

A secretive industry with short production cycles
If companies in the high-tech and electronics industry want to meet the strong competitive pressures, they have to keep their innovation and production cycles as short as possible in order to bring out new products faster than their competitors. It is also important to keep the competition from learning about your operations, because every detail about the machines used allows conclusions to be drawn about production. The short product and innovation cycles in the electronics industry also place a tremendous amount of time pressure on machine manufacturers. They are expected to deliver high-precision machines for manufacturing the new models – and they have to do so as quickly as possible while maintaining absolute secrecy. Fast engineering is required, as are fault-free machines. One company that can hold its own in this difficult market and is highly familiar with challenges faced by its customers is Chinese machine manufacturer Bozhon Precision Industry Technology Co.Ltd. Bozhon worked with Siemens on one of its many current projects that included the development of a digital twin.

The project Bozhon and Siemens had in mind sounded a little unusual at first: In the lead-up to the Hannover Messe, in Germany Siemens created a digital twin for a machine that was being manufactured concurrently in China. It involved an assembly cell with robot arms, and it was used at the trade show to demonstrate how the front and back of a cell phone housing are joined together.

Faster time-to-market with a digital twin

Faster time-to-market with a digital twin (@siemens)

Virtual commissioning saves a great deal of time
Bozhon’s objective: to achieve up to 30% in time savings by improving engineering efficiency accelerate the development, delivery, and commissioning of new machines at the customer site. To simulate the desired end product, a virtual 3D model of the planned machine was created, including an interface with the open, cloud-based IoT operating system MindSphere. This enabled data to be recorded and analyzed during subsequent operations and in this way to facilitate actions such as predictive maintenance and power optimization.

The digital twin was a fully detailed representation of the actual prospective machine that would allow its sequences of movement to be simulated. The outcome: the entire value chain was comprehensively represented, tested, and optimized in digital form, from product design through planning and designing the machine itself, all the way to the production process and performance. For Bozhon the development of a digital twin was the right course to pursue, as Karl Chen, CMO of Bozhon, explains: “The development of a digital twin enabled us to meet the demand for simulations. We expect digital twins to include more functions in the future and therefore further enhance companies’ long-term competitiveness.”

While the developers were working step-by-step to simulate the machine using the digital twin while also completing a virtual commissioning process, the real machine was being manufactured at the same time in China. Fast development and commissioning of machines creates a crucial advantage for machine manufacturers in their race against the competition – and the digital twin puts them a step ahead.

 

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Bruker’s nano-DMA solution’s AFM viscoelastic measurements match bulk DMA

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Bruker announced the release of the AFM-nDMA™ mode for Dimension® atomic force microscopes (AFMs). Going beyond the quantitative elastic modulus mapping enabled by Bruker’s exclusive PeakForce QNM® mode, AFM-nDMA provides first and only nanoscale viscoelastic measurements that match bulk dynamic mechanical analysis (DMA) over the entire frequency range typical in bulk rheological measurements.

Enabled by proprietary algorithms, AFM-nDMA works directly at rheological frequencies, quantifies preload and adhesion, and comes with absolute calibration. As a result, AFM-nDMA generates entire master curves of storage modulus, loss modulus, and loss tangent, including analysis for activation energy, thus vastly expanding the AFM market by providing polymer rheology at the nanoscale.

“Bruker’s AFM-nDMA is the first commercial solution for quantifying viscoelasticity at the spatial scales of AFM,” said Dr. Ken Nakajima, Professor of Polymer Physics at Tokyo Institute of Technology. “Having pioneered nanoscale rheological measurements, I am very excited to see this important capability become widely available.”

“We can now quantify local viscoelasticity at relevant frequencies and length scales that relate nanoscale properties to bulk performance,” added Greg Meyers, Ph.D., Dow Chemical Core R&D Fellow. “This addresses a significant unmet need for industrial polymer characterization.”

“AFM-nDMA reflects our long-standing commitment to provide quantitative and easy-to-use nanomechanical characterization,” explained David V. Rossi, Executive Vice President and General Manager of Bruker’s AFM business. “From the invention of TappingModeTM to PeakForce Tapping® and now AFM-nDMA, we have consistently led this charge, and we are very eager to see the use of atomic force microscopy growing with quantitative viscoelastic characterization.”

www.bruker.com

 

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EtherNet/IP is enhanced to integrate HART devices

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ODVA announced that it has published enhancements to The EtherNet/IP Specification which outline how to integrate devices built to the HART Communication Protocol into an EtherNet/IP architecture. The addition of this capability fulfills yet another step in the optimization of EtherNet/IP for the process industries by providing a mechanism for users to integrate their existing infrastructure while leveraging the benefits of industrial Ethernet.

This volume defines a standard mechanism for integrating HART devices into the Common Industrial Protocol (CIP) suite. With this mechanism, a CIP originator can communicate with a HART device as if it is a native CIP device. The result is seamless communication between CIP-based devices and HART-based devices, without requiring changes to existing HART devices or CIP originators such as industrial control systems.

“The integration of conventional HART I/Os is another step in fulfilling ODVA’s vision for the Optimization of Process Integration,” stated Olivier Wolff, chair of the ODVA technical working group for EtherNet/IP in the Process Industries. “Now that the initial focus to integrate conventional field devices with industrial control systems and asset management systems is complete, the organization will continue to adapt EtherNet/IP to the full spectrum of process industries’ needs, including profiles for field devices to simplify device integration, diagnostics according to NE107, and comprehensive device configuration methods.”

ODVA is also involved in industry-wide efforts to promote adoption of Ethernet overall in the process industries, such as its collaboration with FieldComm Group and PROFIBUS and PROFINET International to help promote adoption of Ethernet to the Field that will be made possible by forthcoming enhancements to the IEEE 802.3 Ethernet standard for long-reach single pair Ethernet and use in hazardous areas.

www.odva.org

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