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Universal Robots at the Hanover Trade Fair 2017

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유니버설 로봇, 위스트론의 노트북 생산라인에 투입

For the first time ever Universal Robots presents turnkey solutions from its sales partners at the Hanover Trade Fair 2017. Four integration partners of the market leader in collaborative robotics provide insights into the broad spectrum of the application potential offered by the robot arms UR3, UR5 and UR10 at the trade fair booth (Hall 17, Booth C26).

The host this year is Universal Robots GmbH, the newly founded local company for the region of Western Europe. The new trade fair concept is to give an idea of the simple and cost-efficient integration of flexible lightweight robots to end customers, ultimately also by the “Universal Robots Academy” training platform. The free online training program will be presented at HMI 2017. The presence of Universal Robots is further being hallmarked by its sustained strong global and regional growth.

Human-Robot-Collaboration: A glimpse of how it works in practice
Together with its partners Müller Maschinenbau GmbH, FAUDE Automatisierungstechnik GmbH, IIS UG and Lorenscheit Automatisierungs-Technik GmbH, Universal Robots demonstrates how versatile human-robot collaboration can be in practice: “As a pioneer in collaborative robotics, our products have been firmly established in the market for years. Our visitors at the trade fair are meanwhile looking for something more than just our “naked” product. They come to us with firm ideas and specific inquiries for applications,” explains Helmut Schmid, Managing Director and General Manager Western Europe at Universal Robots.

Visitors are therefore given a practice-oriented insight through applications from labeling, pick&place and assembly, all of which are equipped with accessories from the “Universal Robots+” developer ecosystem. In addition, trade fair visitors can obtain a feasibility analysis of the application they have in mind, including live programming, at the booth.

유니버설로봇의 UR 협업로봇

Making robot programming easy
The “Universal Robots Academy” is another innovation at this year’s trade fair presence. The openly accessible online training program, which is free of charge, makes it even easier to learn how to commission and program the ‘cobots’. Hurdles such as time and money in the integration of automation solutions are therefore further reduced.

Collaborative robotics gathering momentum
Universal Robots continues to chart its growth, both on a global scale and in the region of Western Europe. With the founding of a separate company in the German-speaking area and a larger team, Universal Robots has now given extra consideration to the significance of this growing market. “Our team in Western Europe has doubled its number over the past year,” Helmut Schmid says. “We have hired new staff for sales and technical support so we can continue to accommodate growing demand.” Furthermore, in March Universal Robots GmbH will be moving to its new premises in Munich, with its own training center. The new subsidiary is also intended to be the starting point for the planned extension of the service offering and product training.

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Schneider Electric Innovation Summit Singapore 2018

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파스칼 트리쿠아(Jean-Pascal Tricoire) 회장 겸 CEO

Latest innovations to EcoStruxure architecture unveiled

Schneider Electric, the leader in digital transformation of energy management and automation, is hosting more than 1,500 customers, partners, suppliers and influencers at its latest Innovation Summit, September 20-21 at Singapore Marina Bay Sands. The event brings together Schneider Electric experts and world-leading industry thinkers to share insights and bold ideas on the challenges and opportunities of Powering and Digitizing the Economy.

Schneider Electric Innovations Unveiled for East Asia

In its second year running, this year’s Innovation Summit World Tour includes 20 events across the world, double the 2017 program. The Singapore event will be Schneider’s largest in East Asia, and the company will showcase its latest developments to EcoStruxure™, its IoT-enabled, plug and play, open, interoperable, architecture and platform. EcoStruxure™ delivers enhanced value around safety, reliability, efficiency, sustainability, and connectivity. EcoStruxure™ leverages advancements in IoT, mobility, sensing, cloud, analytics and cybersecurity to deliver Innovation at every level, from Connected Products, Edge Control to Apps, Analytics & Services. EcoStruxure™ has been deployed in 480,000+ sites, with the support of 20,000+ system integrators and developers, connecting over 1.6 million assets under management through 40+ digital services.

파스칼 트리쿠아(Jean-Pascal Tricoire) 회장 겸 CEO

Major EcoStruxure developments will be presented at the Summit:

• EcoStruxure Power: the next generation of Schneider Electric’s IoT-Enabled platform and architecture for electrical distribution will be announced, dramatically strengthening power management capabilities for customers to improve operational efficiency and reliability. New user applications (EcoStruxure Power Advisor), edge control management software (EcoStruxure Power Monitoring Expert 9.0 and Power Scada Operation 9.0), and connected products (Powerlogic ION9000 Meter and Easergy P3 Protection Relay) will be announced.

• EcoStruxure Building: this smart, collaborative platform and architecture designed for buildings delivers maximum building efficiency and increased people comfort and productivity. EcoStruxure Building will benefit from new user applications (EcoStruxure Building Advisor), a new edge control application (Ecostruxure Building Operation 2.0), as well as new connected sensor products (SmartX IP Controller MPx and SmartX Room Sensors).

• Ecostruxure Plant & Machine: our IIoT technologies, including integrated software, are ready for smart manufacturing and can deliver new business opportunities for plants and machine builders – increasing profitability (EcoStruxure Triconex) and productivity (EcoStruxure Machine Advisor).

• EcoStruxure Asset Advisor: the new version of Schneider Electric’s equipment monitoring services application brings a much-needed cloud-based, data-driven 24/7 predictive service for business continuity in electrical distribution and critical data center assets.

Bold ideas for the digital economy

“The world is changing at an unprecedented rate driven by a booming digital economy. Technologies such as the Internet of things (IoT), artificial intelligence and big data analytics are making companies more efficient and innovative, boosting their competitive advantage,” said Jean-Pascal Tricoire, Chairman and CEO, Schneider Electric. “As a responsible industry leader, we need to demonstrate how our innovations help our customers and partners make a successful digital transformation in energy management and automation. Our technologies, built on EcoStruxure™, harness the power of digitization, enabling our customers to become more efficient, safe, reliable, connected and sustainable – leaders in the New Digital Economy.”

During the two-day event, customers, partners and suppliers can attend Strategy Talks on topics as varied as “Redefining power distribution”, “Intuitive manufacturing, thanks to digitization” and “Reinvented buildings.” Schneider Electric is also conducting 15+ Expert Learning Sessions with its stakeholders, delivering concrete customer successes and solutions and interactive discussions between participants. Finally, a 3,700 m2 Innovation Hub will demonstrate the wealth of Schneider Electric’s software, solutions and services. The Singapore Innovation Summit will also feature the company’s growing network of Strategic Digital Alliances, Technology Partners, EcoXpertsTM and Start-Ups. Over 20 partners are represented, including Microsoft, Accenture, Cisco, Dell EMC, Autogrid, Danfoss, Somfy, and AVEVA, that complement Schneider Electric EcoStruxureTM solutions.

More information on Innovation Summit Singapore is available on Schneider Electric website.

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New Technologies Pair the Physical with the Digital

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mouser

Digital twinning is one part of the technology road map for Industry 4.0 and the Industrial Internet of Things. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain.

mouser

Digital twinning seeks to improve the design and maintenance of physical systems by offering datadriven ways to discretely map these physical systems into digital and computerized replicas of themselves. With the arrival of automation and data exchange, digital twinning could be useful in a myriad of industrial applications.

This new industrial context, where the physical and the digital worlds meet, is known as the fourth industrial revolution—or Industry 4.0. Brought on by the intersection of a host of high-technology electronic and computer systems, the “new way” of Industry 4.0 promises increasing gains, efficiencies, and flexibility. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain. Digital twinning is only one part of the technology roadmap for Industry 4.0, as these additional technologies are helping to enable digital twinning for Industry 4.0 to manifest its potential:

• Pairing technologies
• Cyber-physical systems
• Augmented, virtual, and mixed reality
• Artificial intelligence
• Additive manufacturing
• 3D printing
• Digital thread

Pairing Technologies
Pairing technologies are critical to digital twinning and the world of Industry 4.0, as these technologies empower a device or system to find, connect, and communicate with other devices and systems. For example, sensors and the Industrial Internet of Things (IIoT) products require the ability to find and connect with other devices successfully. Technologies such as Bluetooth®, among others, are employed to make these connections. To accomplish this, connected devices must be able to interrogate other potentially connectable devices successfully. When inquiring other devices, units must be able to ascertain whether they are communicating with a unit that they should be corresponding and exchanging data with. When properly enabled and successful, this accomplishment is called pairing.

Security issues are paramount. Every device should pair only after proper identification has been confirmed to avoid crosstalk or misinformation. Shortcuts may be achieved through programming algorithms that allow the devices to quickly and easily identify other units that they should pair with. Pairing gets accomplished through authentication keys employing cryptography. Pairing works to ensure that the connections stay bonded in a data exchanging relationship between devices and works to prevent an external source from prying into their data exchanges.

Being that flexibility is paramount, units must be able to make and break their pairing quickly and without external, human involvement. Successful pairing may require ongoing communication to keep the pairing active. If one of the units determines that the pairing bond is no longer relevant to its successful operational objectives, it will remove its pairing relationship and present itself available for a different pairing opportunity.

(photo. Mouser Electronics)

Cyber-Physical Systems
The National Science Foundation (NSF) defines cyber-physical systems (CPS) as, “The tight conjoining of and coordination between computational and physical resources.” The critical element in this definition is that it focuses on a system approach— where a set of connected things or parts form a complex whole.

A current example of a CPS is the automated airline flight-control systems. Industry 4.0 requires traffic control, not for airplanes, but for the machines, computers, robots, sensors, and processes that comprehensively work together for its realization. It represents a system of higher order than IIoT, because it sits one level higher in the complexity chain. Where IIoT is concerned with collecting, handling, and sharing of large amounts of data, CPS is focused on ensuring that this large amount of data, collected from multiple systems, gets properly utilized across multiple disciplines that are relevant to the industry involved. The unique dilemmas of any given industry will require engineering expertise to address these specific challenges.

Augmented, Virtual, and Mixed Reality
New technologies are augmenting our reality. They are providing us with the ability to overlay digital content in front of us physically, merging the real with the virtual, creating a mixed reality that should be considered augmented. This gain is allowing engineers to view things in new ways. For example, rather than viewing a DT on a computer monitor, we could view a DT using an augmented reality (AR) headset that enables the users to engage with digital content or interact with holograms.

The use of such AR empowers viewers to have an immersive experience whereby they engage their bodily senses.

Reality-enhancing headsets can create real-time experiences of actual conditions happening in the physical world, by way of experiencing them through a digitized environment. AR could lead to new insights and understandings. Additionally, a DT display could appear in the user’s field of view, making real-time feedback that much more accessible and easy to use.

Artificial Intelligence Technologies
IIoT offers the promise to provide connected data; therefore, useful data must be stored and analyzed. Artificial intelligence (AI) is a solution to how to analyze and successfully handle large amounts of digital data. It helps in allowing digital twinning to become more realized because it promotes value by enabling rapid integration, hybrid integration, investment leverage, and system management and compliance.

Through machine learning, it offers the opportunity to use digital data to model, analyze, train, apply, and infer how best to make decisions. AI is helping to change the traditional perspective of computing, moving it beyond what primarily has been an automating- and scaling-process perspective towards a knowledgebased perspective, via actionable insights. Soon, it will help engineers gather new insights and ways to create value. By using a data-science approach, rapidly powered decisions will enable the generation of further opportunities.

Additive Manufacturing
Additive manufacturing (AM) is a method of production in which 3D objects are built by adding layer-upon-layer of material. AM holds promise because it leads to industries that can address variable demand and produce products that are distributable and flexible. Two areas of AM – 3D printing and digital thread – are advancing to make digital twinning possible.

(photo. Mouser Electronics)

 

3D Printing
3D printing is perhaps the most well-known example of AM. In 3D printing, a printer is programmed to print an object using plastics, metals, or other custom materials with virtually zero lead-time. 3D printing is extremely flexible and eliminates the issues involved in producing objects with large economies of scale. What this means for the future is that you will be able to get what you want quickly—as if walking up to the fast food counter.

Digital Thread
With complex systems, however, AM has been confined primarily to the laboratory because all the systems involved do not operate under a unified system and, thus, are hard to scale. Digital thread promises to change that.

카카오톡에서 친구추가 하세요

A digital thread is a single, seamless strand of data that acts as the constant behind a data-driven digital system. It activates the potential of AM by allowing a unification of disparate applications by way of their adherence to the thread, which is their source of shared information. A digital thread creates an easier process for collecting, managing, and analyzing information from every location involved in the redesigned Industry 4.0. It enables better and more efficient design, production, and utilization throughout the entire process.

Conclusion
Digital twinning will be a hallmark of Industry 4.0, helping to increase gains, efficiencies, and flexibility for existing products and processes. But digital twinning is just one part of the Industry 4.0 road map. Pairing technologies, CPS, AI, and AM are key to seamlessly bringing together the physical realm and the realm of its DT information and insights. While these technologies are bringing their complexities into the digital twinning equation, ultimately, they promise to enable Industry 4.0 to manifest its potential.

by Paul Golata for Mouser Electronics

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Nanusens now live on Crowdcube for Pre-Series A fund raising

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Nanusens motion sensor

Investment in high technology start up from as little as £10

Nano-technology Company, Nanusens, has taken an innovative step of crowd funding for a round of investment. Investment starts from as little as £10 on www.crowdcube.com/nanusens

Nanusens CEO, Dr Josep Montanyà i Silvestre, explained: “We have venture capital firms already investing in this round that have been supporting us for a number of years as they believe in our novel technology. I think we are one of the first high technology companies to also offer the opportunity for people to easily invest using the simple process of Crowdcube. We already have 135 investors and raised £131,500 on Crowdcube, which is a 32% of the way to our target.”

Nanusens motion sensor

Investing via Crowdcube can be done via a credit card payment or PayPal and only becomes effective once 90% of the target figure of £400,000 has been reached at the end of the crowd funding campaign.

Until now, sensors had to come off the standard CMOS production line to have the MEMS created on them using different processes. Nanusens multi-patent pending technology enables it to create nano-sensors using a standard CMOS processes within the same production flow as the rest of the chip production. This innovative approach dramatically reduces the size and cost of the sensors along with up to 85% reduction in the time to market.

Nanusens CEO, Dr Josep Montanyà i Silvestre”Our first silicon nano-sensor samples from GLOBALFOUNDRIES exceeded our expectations,” explained Dr Montanyà, “with a sensitivity that is an order of magnitude above what is needed for a motion sensor in most applications. The mechanical operation of the nano-sensor design was the tricky part to get right, as that is where the innovation happens. That works perfectly and the design is fixed. Everything from now onwards just involves standard CMOS processes. Partnering with GLOBALFOUNDRIES will ensure good yields and that we will be able to rapidly ramp up production as sales take off. We have a disruptive technology solution that will revolutionise the sensor market and meet the ever-increasing demand for low cost sensors in smartphones, wearable technology and IoT devices that has already made sensors a multi-billion dollar industry.”

Nanusens has the supply chain fully defined, having partnered with trusted providers, like JCAP, member of JCET, the largest assembly group in China. The first product is planned to be ready by September. Upon finishing the electronic part and doing final qualification, sales will start. Nanusens is already in conversations with potential customers in China with whom the final specifications have been defined.

How the sensors are made using standard CMOS processes
The Inter Metal Dielectric (IMD) is etched away through the pad openings in the passivation layer using vapour HF (vHF) to create the nano-sensor structures. The holes are then sealed and the chip packaged as necessary. As only a standard CMOS process with minimal post-processing is used, and the sensors can be directly integrated with active circuitry as required, the sensors can potentially have high yields similar to CMOS devices. Further details can be seen at https://vimeo.com/258745205

more information at www.nanusens.com

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