YES (Yield Engineering Systems), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, has signed an agreement to license Deca Technologies’ Rapid Cure technology. The Deca IP, a combination of UV and direct thermal exposure that significantly lowers curing temperature and process time, will enable YES customers to reduce thermal budgets for the organic and inorganic thin films used in semiconductor front end, packaging and display applications.
“We are extremely pleased to join forces with Deca, an acknowledged leader in the Advanced Packaging field, to enhance our thermal processing portfolio,” said Rezwan Lateef, President of YES. “The addition of Deca’s Rapid Cure technology to our cure capabilities allows YES to address a broader variety of Advanced Packaging applications including low temperature polymer cure, underfill bake, adhesive curing, degas/curing of low-K films, and a variety of new fan-out processes. Ultimately, this partnership will provide our customers with a wider array of thermal processing tools with lower CoO and better reliability to enable next generation products.”
“We are delighted to collaborate with YES’s innovative team to extend Rapid Cure into multiple new product applications,” stated Tim Olson, founder & CEO of Deca. “M-Series™ technology has demonstrated industry leading fan-out performance. Rapid Cure has proven to be an integral part of the process which produces consistently excellent quality and reliability.”
