Connect with us

English News

Siemens and Munich Airport agree on strategic partnership for digitalization

Published

on

Siemens is using its IoT operating system MindSphere as a platform for new digital applications

Siemens and Munich Airport have forged a strategic partnership for digitalization in order to work on the airport’s digital future together with further partners. Over the coming years, the partners want to use data analytics, Internet of Things (IoT) technologies and artificial intelligence to improve, for instance, the energy efficiency of airport buildings and the logistics for the baggage handling system. Plans also call for using these capabilities to make the time that passengers spend at the facility more pleasant. To meet these goals, Siemens is becoming a developmental partner for LabCampus, the major project for the airport’s digital future. For the digital technologies, Siemens is using MindSphere, its open, cloud-based operating system for the Internet of Things.

“For airports, in particular, digitalization offers great opportunities for optimizing operations,” said Roland Busch, member of the Managing Board and Chief Technology Officer at Siemens. “That’s why we, as the worldwide market leader in industrial automation and digitalization, are cooperating with Europe’s only five-star airport.” In 2017, the London aviation research consultancy Skytrax awarded this status to Munich for the second time.

The new LabCampus, which is being presented today, is Munich Airport’s new innovation center. There, companies, start-ups, universities and research institutes are to work together on new technologies. At this cross-disciplinary center for cultivating ideas on the airport campus, Siemens and Munich Airport will be developing pioneering solutions in fields of innovation such as mobility and energy management as well as safety and security.

Siemens’ developmental efforts currently focus on five fields of innovation. This includes intelligent guidance of passenger flows, seamless tracking of luggage, and buses that drive autonomously on airport grounds as well as predictive maintenance for, and operation of, systems such as the baggage handling and building technology. For this development work, Siemens is using MindSphere as the IoT platform. MindSphere can be used to develop and operate new apps and digital services. This approach makes it possible to quickly gather and evaluate the immense amounts of data that are generated at the airport. Individual data silos, for instance, are linked together in this way, and information for later optimization efforts is derived from these sources.

Siemens has maintained close ties with Munich Airport for about the past 20 years. Siemens Postal, Parcel & Airport Logistics (SPPAL), for example, installed the baggage handling system for Terminal 2 and supplied the extension for the satellite terminal that was opened in 2015. This system, which is 45 kilometers long, sorts up to 17,800 pieces of luggage per hour. Last year, the contract for operation and maintenance of the entire system was renewed. In addition, the SPPAL experts are currently working on a new solution for seamlessly tracking pieces of luggage. Here, cameras worn by the baggage-handling staff are to scan the bags automatically – a task that until now has been performed manually in a labor-intensive process.

hordon kim / hordon@icnweb.co.kr

English News

Siemens offers industrialized 3D printing for complex challenges in various industries

Published

on

Opening of the new state-of-the-art 3D printing facility at Materials Solutions Ltd. in UK

With the opening of the new state-of-the-art 3D printing facility at Materials Solutions Ltd. in the U.K., Siemens is continuing to drive the industrialization of additive manufacturing (AM). The investment of €30 million in the new U.K. facility enables the growth of the business by doubling the capacity of 3D-printing machines to 50 and will also increase its post-processing capabilities. Siemens is taking AM out of the traditional research laboratory into an industrialized production factory. By employing industrial methods to scale up production, Siemens can bring down the costs of AM by manufacturing high-end complex metal parts in serial production in a robust industrial environment. With an entire digital end-to-end chain, Siemens is efficiently solving complex customer challenges by producing high-end serial parts for Siemens Power and Gas and customers in the aerospace, automotive, motorsport, and other industries.

The picture shows the state-of-the-art 3D printing facility at Materials Solutions Ltd.

The picture shows the state-of-the-art 3D printing facility at Materials Solutions Ltd.

The new factory has a footprint of 4,500 m2 and is adopting a true industrial approach, housing multiple machines across a shop floor. The parts move through a variety of processes, with engineers ensuring that they’re compliant. The digital approach embedded in the factory site creates a modern digital factory and provides end-to-end service to customers. The factory employs many of Siemens’ latest digital factory and AM technologies, including an end-to-end PLM chain, Siemens’ computer-aided design software NX, and MindSphere, the Siemens cloud-based, open IoT operating system that connects products, factories, systems, and machines with data analytics. Virtual production begins long before the actual printing. By leveraging Siemens’ design experience and expertise, Materials Solutions Ltd. is offering various design services for AM. Siemens provides engineering services and consulting to help create a digital twin of the 3D printed component. The company’s comprehensive experience is the ideal prerequisite for automating and thereby industrializing 3D printing, including post-processing, until qualification and certification – all under one roof.

“Siemens is the only company with such a comprehensive portfolio for driving the industrialization of AM. Built on the foundation of our global Siemens R&D and manufacturing footprint, the new facility is a huge step in pioneering the industrialization of high-end AM,” said Willi Meixner, CEO of the Siemens Power and Gas Division. “Combining the full power of Siemens with the strengths of Materials Solutions Ltd. offers unique and proven technologies for our in-house gas turbine business and for external markets and industries. We already have a significant number of core AM components in our portfolio.”

Siemens’ leading metal AM technology has been validated through its in-house application in the company’s Power and Gas and Power Generation Services businesses. It has been additively manufacturing hot rotating parts for use in its gas turbines, and the company has now gathered more than 110,000 hours of engine experience with 3D-printed gas turbine parts in fully operational power plants.

Materials Solutions Ltd. is also supporting Siemens’ latest HL-class gas turbines with AM components in serial production to drive emission reduction and increased performance in the gas turbines. Siemens will use AM technology to manufacture combustion components for the SGT5-9000HL gas turbine, and they will be used for the first time by the Scottish energy company SSE plc at the combined cycle power plant Keadby 2 in Lincolnshire, U.K.

“Whether it’s materials, machines, processes, or the digital value chain, we’re always pushing the boundaries of technology. Printing components for gas turbines means the highest material and technology requirements. If you can print a gas turbine blade, you can print pretty much anything,” said Markus Seibold, Vice President AM at Siemens Power & Gas. “The end-to-end software and automation solutions – combined with our comprehensive expertise and our large printer fleet – makes Siemens a world leader in industrializing additive manufacturing, driving productivity, and getting complex 3D-printed parts right the first time. We’re in the unique position of being able to leverage our advanced user expertise to bring these solutions to external customers via Materials Solutions Ltd.”

Siemens recently brought a 100-year-old Ruston Hornsby vintage car back to life using reverse engineering to recreate its steering box. With no original technical drawings available, Siemens digitally reassembled the parts of the broken steering box and created a working model that could be additively manufactured.

Materials Solutions Ltd. has extensive experience serving its customers in some of the most challenging industries, from power generation, aerospace, automotive, and motorsport to tooling and processing. The company has already additively manufactured thousands of functional parts and provided legacy parts through reverse engineering and tooling to over 80 customers worldwide. In 2016, Siemens acquired a majority stake (85 percent) in Materials Solutions Ltd., which was established in 2006.

Continue Reading

English News

Rockwell Automation Joins Initiative to Bring OPC UA to Field-Level Devices

Published

on

By

Rockwell Automation is joining an OPC Foundation initiative to extend the OPC UA protocol to field-level industrial communications.

Under the initiative, a series of working groups are being formed to bring the OPC UA protocol’s vendor-independent, end-to-end interoperability to field-level devices. The initiative plans to address use cases not currently in scope for EtherNet/IP. It could also simplify other use cases, especially in multi-vendor, controller-to-controller environments and for the vertical integration of field devices.

“Rockwell Automation has always supported the development and use of open standards,” said Paul Brooks, business development manager, Rockwell Automation. “Extending the OPC UA protocol to the field level or shop floor can help simplify system development and accelerate a company’s journey to a Connected Enterprise.”

As the primary author of the EtherNet/IP specifications, Rockwell Automation understands EtherNet/IP users may see compatibility risks in technology developed for a different ecosystem. The company intends to mitigate these risks through both its ongoing development of EtherNet/IP and its intentions for the OPC UA protocol.

Rockwell Automation’s priorities within the new OPC Foundation initiative include working to help ensure the following:

OPC UA specifications are written with the same level of rigor and completeness as the EtherNet/IP specifications.
Time-sensitive networking (TSN) is commonly applied across the OPC UA, EtherNet/IP and PROFINET protocols, so all three can coexist on a common TSN-based network.
OPC UA pub/sub technology is implemented in a way that allows existing EtherNet/IP installations to support OPC UA devices.
OPC UA hardware requirements allow the protocol to be deployed on hardware platforms that are common in today’s EtherNet/IP components.
OPC UA software requirements allow the protocol to be deployed within current EtherNet/IP-centric software tools without significant changes to user workflows.
Conformance test practices mandated for EtherNet/IP reflect the necessary requirements for OPC UA conformance testing.

“We are committed to these priorities to help make sure EtherNet/IP users have a choice of whether and when they migrate to the new OPC UA protocol,” Brooks said. “We want users to determine the pace of this migration based on the value that they receive, rather than technology choices made in the specification. We trust that others engaged in the initiative will share this common goal.”

Continue Reading

English News

[#SPS] Weidmüller and KEBA announced strengthened partnership for digitalisation and automation

Published

on

By

The electronics company Weidmüller and the Austrian expert for industrial automation KEBA are now collaborating to complement each other’s digitalisation and automation portfolios.

Both companies announced this partnership on the occasion of SPS 2018 in Nuremberg. The collaboration focuses on shared offers for industrial automation technology with a focus on the area of machinery and plant engineering. Both companies also want to promote the utilisation of artificial intelligence (AI) in automation.

Weidmüller and KEBA partnership

Weidmüller and KEBA partnership for automation solutions

“We are happy to have found an experienced partner in industrial automation with KEBA who will help to complement our automation expertise. Combining u-control and the KEBA Engineering Suite ideally supports our customers with the implementation of ambitious automation concepts and Industry 4.0 solutions,” explains Volker Bibelhausen, CTO of the Weidmüller Group.

Michael Matthesius, Head of the Automation Products & Solutions division at Weidmüller sees this the same way: “When two excellent companies like Weidmüller and KEBA cooperate, our customers can be sure that one plus one will equal more than two in this case.”

Gerhard Luftensteiner, CEO of KEBA AG adds: “We are convinced that our product and service offerings for industrial customers complement each other ideally. From now on, customers looking for excellent digitalisation and automation solutions for Industry 4.0 will benefit from our combined expertise.”

With the cooperation, Weidmüller with its headquarters in Detmold, Germany, and KEBA based in Linz, Austria, are striving for a coordinated representation at the customer with a focus on the area of machinery and plant engineering in their respective markets. In so doing, the partners will mutually provide relevant components of their portfolios to each other.

KEBA will mainly contribute its open software solutions and parts of its control architecture, while Weidmüller will primarily contribute its u-mation product family expanded for SPS 2018 and its innovative industrial analytics offerings to the collaboration. Both companies rely on a close collaboration to further develop the product, solution and service offerings.

KEBA, founded in 1968 in Linz, is an expert for industrial automation with a focus on series machine engineering, robotics and plastics engineering as well as banking automation, electric mobility, logistics solutions, lottery solutions and heating controls.

Weidmüller, based in Detmold, Germany, is an expert for automation, digitalisation, communication and connecting components such as software and solutions, especially for industry. Both companies are privately owned.

Continue Reading

배너광고

Power Electronics Mag
스마트공장 자동화 산업전
Japan ITweek
네스트필드
  • 힐셔코리아
  • 슈나이더 일렉트릭
  • HMS Anybus
  • 지멘스
  • 비앤드알 산업자동화
eBook 보기

책 판매대

SPS 2018
물류기술 매거진
Advertisement

Trending

© Copyright 2006-2018 아이씨엔미래기술센터 All Rights Reserved.
tel. 0505-379-1234, fax. 0505-379-5678 | e-mail. icn@icnweb.co.kr | Powered by WordPress Flex Mag Theme. Theme by MVP.
Address: 72-31 2F, Changcheon-dong, Seodaemun-gu, Seoul, 03787, Korea
주소: 서울특별시 서대문구 연세로5다길 41, 2층 아이씨엔 (창천동)(우편번호 03787)

업체명: 아이씨엔, 사업자등록번호: 206-11-69466, 대표자: 오승모, 통신판매업신고증: 2009-서울서대문-0373호

기사제보 : news@icnweb.co.kr / 반론청구 : oseam@icnweb.co.kr
아이씨엔의 모든 콘텐츠는 저작권법의 보호를 받습니다. 이의 일부 또는 전부를 무단 사용하는 것은 저작권법에 저촉되며, 법적 제재를 받을 수 있습니다.


[[클린 광고 선언]]
아이씨엔매거진은 어떠한 경우에도 성인, 성형, 사채, 폭력, 투기, 악성SW 및 환경파괴(원자력 포함) 관련 광고는 게시하지 않습니다.
[광고 신고: oseam@icnweb.co.kr]