Digital twinning is one part of the technology road map for Industry 4.0 and the Industrial Internet of Things. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain.
Digital twinning seeks to improve the design and maintenance of physical systems by offering datadriven ways to discretely map these physical systems into digital and computerized replicas of themselves. With the arrival of automation and data exchange, digital twinning could be useful in a myriad of industrial applications.
This new industrial context, where the physical and the digital worlds meet, is known as the fourth industrial revolution—or Industry 4.0. Brought on by the intersection of a host of high-technology electronic and computer systems, the “new way” of Industry 4.0 promises increasing gains, efficiencies, and flexibility. A gamut of new technologies must be integrated to work seamlessly together to pair the physical domain with the digital information domain. Digital twinning is only one part of the technology roadmap for Industry 4.0, as these additional technologies are helping to enable digital twinning for Industry 4.0 to manifest its potential:
• Pairing technologies
• Cyber-physical systems
• Augmented, virtual, and mixed reality
• Artificial intelligence
• Additive manufacturing
• 3D printing
• Digital thread
Pairing technologies are critical to digital twinning and the world of Industry 4.0, as these technologies empower a device or system to find, connect, and communicate with other devices and systems. For example, sensors and the Industrial Internet of Things (IIoT) products require the ability to find and connect with other devices successfully. Technologies such as Bluetooth®, among others, are employed to make these connections. To accomplish this, connected devices must be able to interrogate other potentially connectable devices successfully. When inquiring other devices, units must be able to ascertain whether they are communicating with a unit that they should be corresponding and exchanging data with. When properly enabled and successful, this accomplishment is called pairing.
Security issues are paramount. Every device should pair only after proper identification has been confirmed to avoid crosstalk or misinformation. Shortcuts may be achieved through programming algorithms that allow the devices to quickly and easily identify other units that they should pair with. Pairing gets accomplished through authentication keys employing cryptography. Pairing works to ensure that the connections stay bonded in a data exchanging relationship between devices and works to prevent an external source from prying into their data exchanges.
Being that flexibility is paramount, units must be able to make and break their pairing quickly and without external, human involvement. Successful pairing may require ongoing communication to keep the pairing active. If one of the units determines that the pairing bond is no longer relevant to its successful operational objectives, it will remove its pairing relationship and present itself available for a different pairing opportunity.
The National Science Foundation (NSF) defines cyber-physical systems (CPS) as, “The tight conjoining of and coordination between computational and physical resources.” The critical element in this definition is that it focuses on a system approach— where a set of connected things or parts form a complex whole.
A current example of a CPS is the automated airline flight-control systems. Industry 4.0 requires traffic control, not for airplanes, but for the machines, computers, robots, sensors, and processes that comprehensively work together for its realization. It represents a system of higher order than IIoT, because it sits one level higher in the complexity chain. Where IIoT is concerned with collecting, handling, and sharing of large amounts of data, CPS is focused on ensuring that this large amount of data, collected from multiple systems, gets properly utilized across multiple disciplines that are relevant to the industry involved. The unique dilemmas of any given industry will require engineering expertise to address these specific challenges.
Augmented, Virtual, and Mixed Reality
New technologies are augmenting our reality. They are providing us with the ability to overlay digital content in front of us physically, merging the real with the virtual, creating a mixed reality that should be considered augmented. This gain is allowing engineers to view things in new ways. For example, rather than viewing a DT on a computer monitor, we could view a DT using an augmented reality (AR) headset that enables the users to engage with digital content or interact with holograms.
The use of such AR empowers viewers to have an immersive experience whereby they engage their bodily senses.
Reality-enhancing headsets can create real-time experiences of actual conditions happening in the physical world, by way of experiencing them through a digitized environment. AR could lead to new insights and understandings. Additionally, a DT display could appear in the user’s field of view, making real-time feedback that much more accessible and easy to use.
Artificial Intelligence Technologies
IIoT offers the promise to provide connected data; therefore, useful data must be stored and analyzed. Artificial intelligence (AI) is a solution to how to analyze and successfully handle large amounts of digital data. It helps in allowing digital twinning to become more realized because it promotes value by enabling rapid integration, hybrid integration, investment leverage, and system management and compliance.
Through machine learning, it offers the opportunity to use digital data to model, analyze, train, apply, and infer how best to make decisions. AI is helping to change the traditional perspective of computing, moving it beyond what primarily has been an automating- and scaling-process perspective towards a knowledgebased perspective, via actionable insights. Soon, it will help engineers gather new insights and ways to create value. By using a data-science approach, rapidly powered decisions will enable the generation of further opportunities.
Additive manufacturing (AM) is a method of production in which 3D objects are built by adding layer-upon-layer of material. AM holds promise because it leads to industries that can address variable demand and produce products that are distributable and flexible. Two areas of AM – 3D printing and digital thread – are advancing to make digital twinning possible.
3D printing is perhaps the most well-known example of AM. In 3D printing, a printer is programmed to print an object using plastics, metals, or other custom materials with virtually zero lead-time. 3D printing is extremely flexible and eliminates the issues involved in producing objects with large economies of scale. What this means for the future is that you will be able to get what you want quickly—as if walking up to the fast food counter.
With complex systems, however, AM has been confined primarily to the laboratory because all the systems involved do not operate under a unified system and, thus, are hard to scale. Digital thread promises to change that.
A digital thread is a single, seamless strand of data that acts as the constant behind a data-driven digital system. It activates the potential of AM by allowing a unification of disparate applications by way of their adherence to the thread, which is their source of shared information. A digital thread creates an easier process for collecting, managing, and analyzing information from every location involved in the redesigned Industry 4.0. It enables better and more efficient design, production, and utilization throughout the entire process.
Digital twinning will be a hallmark of Industry 4.0, helping to increase gains, efficiencies, and flexibility for existing products and processes. But digital twinning is just one part of the Industry 4.0 road map. Pairing technologies, CPS, AI, and AM are key to seamlessly bringing together the physical realm and the realm of its DT information and insights. While these technologies are bringing their complexities into the digital twinning equation, ultimately, they promise to enable Industry 4.0 to manifest its potential.
by Paul Golata for Mouser Electronics
Hyundai Mobis to Launch an ‘Open Innovation Center’ in Silicon Valley
Hyundai Mobis begins to make a full-fledged commitment to discover promising global startups and invest in them… Another center to be opened in Shenzhen, China during the first half of next year
Hyundai Mobis has established an “Open Innovation Center,” M.Cube, at Silicon Valley in the U.S. to speed up the search and investment in global startups that have new vehicle technologies such as self-driving.
Also, the company will expand its research branch in Shenzhen, China into M.Cube by adding an investment role to it. M.Cube embodies the company’s commitment to open innovation activities, creativity and incubation.
Hyundai Mobis will use M.Cube as its core base to discover and invest in startups with strong growth potential in the areas such as self-driving (sensors, logic, software platforms), connectivity (Infotainment, biometrics) and innovative new businesses (AI, vehicle security), to strengthen its technologies for future vehicles. To this end, it has appointed as the head of M.Cube Dr. Sean Ryu, who has more than 20 years of experience in startup investments in the US, and will continue to expand the organization.
The M.Cube that is being readied to launch in Shenzhen next year will become its base with a focus on AI and Big Data. Hyundai Mobis is expecting, together with Chinese startups, to secure core technologies for autonomous driving and connectivity optimized for the local market. Shenzhen, which used to be the Chinese mecca of manufacturing industry and has now been transformed into the hub of the 4th industrial revolution, is considered as the best place to discover outstanding startups.
Hyundai Mobis believes that M.Cube will be a win-win for both itself and startups. The company will invest in startups possessing creative ideas, and startups can explore their growth potential with the help of the company’s expertise in core auto components and infrastructure.
“We’ll not just simply invest in startups, but also actively support them with our R&D capabilities such as self-driving and connectivity,” said Jeong Soo-kyeong, Sr. Vice VP of Hyundai Mobis. “Collaboration will be facilitated so that the ideas of startups can be effectively developed into vehicle optimization.”
Meanwhile, Hyundai Mobis is actively promoting open innovation with Korean startups by carrying out events such as M.Start contest. It has recently invested in StradVision which features world-class, deep learning-based image recognition technology and also announced that it is considering engaging in joint research and development with Genesis Lab and Linkflow.
● Strengthening the strategic collaboration with Hyundai CRADLE… as many as a dozen investments will be made into global startups by next year
Hyundai Mobis M.Cube is strengthening its strategic collaboration with Hyundai CRADLE. Through this, it plans to make around a dozen investments in global startups by next year.
Hyundai CRADLE focuses on integration between technologies for future vehicles such as mobility service and smart city and finished vehicles, and M.Cube on investments in startups that possess core technologies such as self-driving and connectivity. It is a strategy where they will establish a value chain that starts from core technologies, auto components, finished vehicles to future vehicles, and increase investment efficiency.
Hyundai Mobis will expand its investment in startups by collaborating with Hyundai CRADLE in areas where M.Cube has not been established such as Israel, Europe and Asia. In particular, Israel has many startups that are strong in areas such as vehicle security and sensors, and support from the government and universities there is abundant. In France and Northern Europe, where entrepreneurial activities per capita are higher, auto component and mobility startups are expected to be the main investment targets.
● The synergy between open innovation and research centers in both Korea and overseas are expected to be increased
Hyundai Mobis is expecting notable synergy effects between M.Cube and research centers located in Korea and overseas. It aims to integrate R&D capabilities gained from these research centers and core technologies acquired through investment in startups.
Of particular note, last August, Hyundai Mobis invested in StradVision which has world-class image recognition technology, and announced that it plans to develop a deep learning-based camera by 2020. It will be an upgraded next-gen AI camera made through integrating ADAS, the self-driving technology of Hyundai Mobis and image recognition technology of StradVision.
Hyundai Mobis is currently operating a technology research institute in Korea and a total of four overseas institutes in areas such as North America, China, Germany and India. The institutes, where a total number of 3,000 researchers are working now, play a role in establishing a roadmap for overall R&D of the company. Its leading role is vital in the entire scope of R&D such as self-driving, eco-friendly products and chassis components.
The overseas institutes are carrying out customized R&D activities for each region. The institute in North America is developing prior art such as self-driving, the one in China is developing auto components for local vehicles, the one in Europe is making sensors and chassis components and the one in India is increasing its research capability specializing in software. Aside from this, the company also has a research institute in Vietnam that conducts analysis on self-driving data.
Mitsui Chemicals POLYMETAC to Be Used in Lightweight Frames of New Autonomous Unmanned Aerial Vehicles
Lightweight and reduction of the number of parts lead to simple structure using metal resin integrally molded technology
Mitsui Chemicals Inc.(President & CEO: Tsutomu Tannowa) announced that the Group’s unique metal resin integral technology, POLYMETAC has been selected for use in the frames of new autonomous unmanned aerial vehicles which are currently being developed by Aerosense Inc. (CEO: Hisashi Taniguchi), a joint venture of Sony Mobile Communications Inc. and ZMP Inc.
POLYMETAC is Mitsui Chemicals’ completely new technology for strong adhesion and bonding of various metals and resins that was not possible using conventional methods.
Out of Mitsui Chemicals’ numerous lightweight solutions, POLYMETAC cuts weight and helps to reduce the number of parts and steps in the manufacturing processes as well. It is a completely new technology that provides totally new hybrid solutions.
Mitsui Chemicals provides Aerosense with hybrid product of carbon fiber reinforced plastic (CFRP) and aluminum joint parts made by its POLYMETAC technology and provides full support in shaping and designing the parts which will be used in the frame of aerial vehicle.
The new joint parts greatly enhance the structural rigidity of aerial vehicles while significantly reducing weight and providing simpler designs by eliminating the need for fasteners such as bolts.
“Our autonomous unmanned aerial vehicles provide solutions to various industrial needs. It is important that we are able to provide greater flight distances and improved performance by reducing weight and the number of parts while ensuring durability and strength of our aerial vehicles,” says Hisashi Taniguchi, CEO of Aerosense. “Mitsui Chemicals’ POLYMETAC technology makes it possible to extend flight distance by 40% providing our customers with greater added value.”
“POLYMETAC allows adhesion and bonding of various metals and resins, and for the current project, CFRP and aluminum parts were integrated by its technology,” says Akio Hirahara, General Manager of Mitsui Chemicals’ New Market Development (Automotive Materials) Division. “Mitsui Chemicals used its cutting edge simulation technology to design simple joint shapes with a single part which were originally composed of approximately 20 pieces. The technology contributes to a 50% weight reduction of joint parts while improving rigidity.”
Mitsui Chemicals will continue to pursue new uses and development of POLYMETACTM technology for state-of-the-art lightweight solutions in automotive and electrical applications.
Arm launches Neoverse, infrastructure IP portfolio for 5G and cloud to edge infrastructure
Delivering the world-class performance, security, and scalability required to support the diverse compute requirements of the next-generation infrastructure from hyperscale to edge access
Last week at Arm TechCon, Arm disclosed details on a dedicated roadmap and new brand of infrastructure-class IP for 5G networks and next-generation cloud to edge infrastructure. Arm® Neoverse® solutions are uniquely designed for higher-levels of performance, security, and scalability not seen today. Innovation from microarchitecture design up through silicon, software, and systems will enable best-in-class solutions to address the diverse and evolving requirements across the entire compute spectrum.
Arm also provided a first look at its Neoverse processor IP roadmap, with early details on upcoming platforms optimized for leading-edge process nodes. The new roadmap is designed specifically for infrastructure, beginning with the launch of the “Ares” IP platform in early 2019 on 7nm and delivering staggering performance gains of 30 percent per generation through 2021. The Neoverse IP roadmap has been specifically architected for the unique performance, efficiency, and scalability requirements needed to keep up with changing data patterns, new workloads, and the ever-increasing demands of an infrastructure evolving to support a trillion intelligent devices.
“Today Arm is sending disruptive shockwaves across the cloud, networking and storage world as Arm Neoverse delivers the foundation for the new global infrastructure to enable a trillion connected devices,” said Drew Henry, senior vice president and general manager, Infrastructure Line of Business, Arm. “Arm Neoverse IP will enable a broad set of our ecosystem partners to transform infrastructure from cloud to edge and push compute to where it’s most needed, store data where most appropriate, and evolve networking to securely connect this complex world.”
In his TechCon keynote, Henry shared his vision for the new infrastructure and the diverse range of use cases Neoverse will address, including hyperscale cloud datacenters, storage solutions, and 5G networks. Arm Neoverse is based on guiding design principles centered around:
- World-class high performance, secure IP and architectures purpose-built for cloud native and networked workloads
- A highly-scalable set of IP optimized for leading-edge process nodes, including “Ares” (7nm), “Zeus” (7nm+), and “Poseidon” (5nm), designed to enable systems across the infrastructure
- A robust ecosystem empowered to build unique and diverse solutions targeting a wide range of use-cases through leveraged investment in unified software, tools, and silicon platforms
“The modern datacenter is no longer a physical construct, but a center of data and compute residing in the cloud and on the edge. More than ever, organizations must consider distributed, connected datacenter design methods to support the data and devices coming in the 5G world,” said Patrick Moorhead, Principal Analyst, Moor Insights & Strategy. “Arm is one of those rapidly emerging in the market and with Arm Neoverse purpose-built IP, it should be well-positioned to support many of the compute spectrum needs from hyperscale to edge access.”
Designing IP and system architectures for focused markets such as server, automotive, and networking has been a key priority for Arm over the past year. In the infrastructure space specifically, Arm has already been successful as the largest architecture deployed in the global internet infrastructure with nearly 30%-unit share. This achievement highlights not only a shift in preferred architecture, but the pervasiveness of Arm-powered technologies across the entire infrastructure market.
The announcement of Neoverse underscores the continued investment Arm and the ecosystem are making to deliver more ubiquitous compute from the cloud to the edge while delivering world-class performance and efficiency for the next generation of distributed cloud to edge infrastructure.
“Ampere is actively developing high-performance Arm-based server CPUs and platforms for the future of hyperscale, cloud, and edge computing,” said Rohit Vidwans executive vice president of Engineering at Ampere Computing. “We are excited about Arm’s commitment to growing the ecosystem of Arm products into new areas with the Neoverse announcement.”
“Combing Arm’s long-term infrastructure roadmap with Broadcom’s best in class networking technology, Broadcom delivers leadership performance products for the datacenter that are still power efficient. Arm’s roadmap enables optimizations that accelerate customer workloads for the evolving compute and connectivity requirements of tomorrow’s datacenter,” said Ed Redmond, senior vice president and general manager, Compute and Connectivity, Broadcom, Inc.
“Marvell® Infrastructure Processors are extensively deployed in a variety of leading network products. They are designed to analyze, secure, compute, and transform in both wired and wireless networks from the edge to the core,” said Raj Singh, senior vice president and general manager, Infrastructure Processors BU, Marvell Semiconductor Inc. “As a long term technology licensee, as well as an Arm IP customer, Marvell is very pleased to see this increased focus on the enterprise and 5G markets with Neoverse IP. We believe this will greatly benefit the whole Arm ecosystem in providing high performance and power-efficient solutions for the next generation of network infrastructure and compute.”
“Choice allows businesses to select the best solution for their needs, and this is true all the way down to the underlying architecture. It’s up to software vendors like Red Hat to be able to support this demand for choice from our customers as they extend operations into the hybrid cloud,” said Stefanie Chiras, vice president and general manager, Red Hat Enterprise Linux, Red Hat. “With this emphasis on choice front and center, we look forward to supporting solutions from the Arm Neoverse ecosystem as our customers seek to match their evolving business requirements to the most appropriate enterprise IT solutions.”
“Time to market in today’s rapidly evolving infrastructure requires proven, scalable IP, development tools, advanced processes, and a complete ecosystem to provide compelling solutions,” said Suk Lee, senior director of Design Infrastructure Marketing Division at TSMC. “The Arm Neoverse ecosystem leverages our most advanced processes to provide the highest performance solutions to a highly connected world.”
“High-performance IP, along with a complete ecosystem, enables customers to take full advantage of the flexibility inherent in our Arm-based products, said Gaurav Singh, vice president, architecture and verification, Xilinx. “The evolution of these cores, coupled with the capability of CCIX, provide an ideal platform for smart offload and purpose-driven edge compute platforms. We congratulate Arm on the launch of Neoverse and are looking forward to what it might enable.”
more info: https://www.arm.com/solutions/infrastructure
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