Connect with us

English News

[#hm17] Smart luggage tags and digitally connected monitoring systems

Published

on

In manufacturing, the intelligent interconnectedness of Industry 4.0 is the way of the future, especially at the subcontracting end of the spectrum. And that, in short, is why integrated manufacturing and smart products will feature so prominently at the Industrial Supply show at this year’s HANNOVER MESSE. In Hall 6, for example, the German-based plastics specialists Arburg GmbH + Co KG and Pöppelmann GmbH & Co. KG will be showing the world what individualized mass production looks like. The two companies will run a live, interactive demonstration of a five-stage process for producing personalized, smart luggage tags. The overall process will combine a mix of injection molding, additive manufacturing, automation and digital integration. The growing trend towards integrated manufacturing is also a key focus for ContiTech. The international rubber and plastics technology company is running a showcase at this year’s HANNOVER MESSE themed ”ContiTech. Smart Solutions beyond Rubber.”

The joint demonstration by Arburg and Pöppelmann straddles two of HANNOVER MESSE’s trade shows: Digital Factory and Industrial Supply. It also symbolizes the steadily growing role of IT in the industrial supply sector. Visitors will be able to witness a pioneering Industry 4.0 manufacturing process from start to finish as smart luggage labels are manufactured right before their eyes in accordance with the principles of distributed production. The exhibit at the Arburg display at Stand K16 in Hall 6 will demonstrate the supreme flexibility and cost-effectiveness of automated, batch-size-one production. Injection molding, industrial additive manufacturing and automation will be combined to achieve customer-specific individualization of the product (luggage tag), and the process data will be recorded and tracked using the Arburg host computer system (ALS). Heinz Gaub, Managing Director Technology & Engineering at Arburg, explains the highlights of this immersive Industry 4.0 application scenario: ”Our mini factory at the Arburg stand (K16) and the associated ’Web shop’ display operated by our partner Pöppelmann (Stand B18) will illustrate the key elements of Industry 4.0: sequential manufacturing at spatially distributed locations, ’mass customization’ – by which I mean customer-specific individualization of high-volume parts through the combination of injection molding and additive manufacturing – and end-to-end traceability of each individual part using our Arburg host computer system (ALS).”

The five stations of smart tag production
Here’s how the display works. At the first station, an individual turnkey solution, consisting of an Allrounder 375V injection molding machine and a flexible, space-saving robot cell with an integrated six-axis robot, produces the luggage tags in high volumes. The robot removes each finished molded part from the machine and fits an NFC (Near Field Communication) chip, thereby enabling the tag to store and communicate information. The next step in the flexible production process can take place at both the Arburg and the Pöppelmann stands. It involves visitors using an input terminal to select their own graphic motifs for the design of their tag and to generate an electronic business card (vCard). The vCard data is then loaded onto the tag’s NFC chip at the Arburg stand. At its stand (B18), Pöppelmann will showcase the ’Web shop’ component of this Industry 4.0 business model. This involves customers (visitors) entering their individual luggage-tag requirements via an online portal. Each such ”order” generates a QR code that is either emailed directly to the customer’s smartphone or printed out on paper. At the Arburg stand, the QR code is read by a scanner, and the associated data is loaded onto the NFC chip for use in the downstream production process. Thus, in true Industry 4.0 style, the part being processed (in this case, the luggage tag) carries its own data and is able to identify itself to the individual downstream processing stations and manage the remainder of the production process.

Thorsten Koldehoff, Sales Manager, Pöppelmann KAPSTO®, explains: ”As contributors to this demo application, we are striving to give visitors a tangible feel for how individual customer requirements and preferences can flow into the overall production process, thus opening up completely new business models.”

Constant traceability of process and quality data
At the next station, the customer’s personal data (name, address, phone number, etc) and vCard in the form of a QR code are laser-marked onto the tag. All of the parts handling tasks associated with this are performed by an Integralpicker V vertical picker machine. Next, the tag is further individualized by a Freeformer 3D printer, which additively applies the graphic motif that was selected at the second station. In this way, something that starts out as a large-volume product is transformed into a fully individualized product. At the final station, visitors discover how they can use their smart luggage tags to perform data-supported actions, such as placing online orders for brochures using the integrated NFC chip. Furthermore, the visitor’s contact data can be read from the card either via QR code scanner or NFC scanner. The dataset includes the individual URL address of the tag’s website. The website in turn contains all of the tag’s process and quality data, which can be tracked at all times.

ContiTech invests in smart systems and integrated solutions
”Digitalization is a major opportunity for us to work with our customers to generate added value on a lasting basis,” explains Hans-Jürgen Duensing, the member of the Continental Executive Board responsible for the ContiTech division. ”As suppliers to industry and hence as part of the overall value chain, we can play a key part as enablers of digitalization and shapers of the necessary industrial infrastructure. Intelligently connected systems, machinery and equipment pave the way for this. Which is why we’re working tirelessly to make our products and systems smarter and offer end-to-end solutions.”

At this year’s HANNOVER MESSE, ContiTech (Hall 6, Stand F18) will unveil its permanently installable and digitally connected monitoring system for steel cord conveyor belts. Conveyor belts are the beating heart of many industrial sectors. They are used in a multitude of applications and environments, ranging from open-pit and underground mining to transportation of goods up steep inclines and across distances spanning kilometers. In harsh operating conditions, they transport loads weighing several tons, not to mention sharp, hot, oily and greasy goods. Their fault-free operation is often crucial to the cost-effectiveness of entire production chains. Prolonged belt system outages can bring entire production systems to a complete standstill, costing their operators a fortune in lost sales. That is why plant operators are increasingly turning to preventive maintenance based on innovative electronic monitoring systems that accurately track the operating states of their conveyor belt systems at all times.

Using RFID to optimize localization of longitudinal rips
”Serious conveyor belt damage, such as longitudinal rips and splice faults, for example, can have major consequences for overall system operation and, at worst, can even lead to total system failures,” explains ContiTech application engineer Patrick Raffler. ”With the Conti MultiProtect monitoring system, operators can continuously check for these sorts of faults without having to shut the system down. This enables them to detect faults early on and initiate repairs well before the damage worsens and results in a prolonged stoppage.” The way it works is that rip inserts are implanted in the conveyor belt and continuously monitored for telltale changes in their magnetic fields. In other words, if a belt begins to rip, the insert will also be damaged, which changes its magnetic characteristics. What’s more, each rip insert has an RFID chip that enables the operator to pinpoint the exact location of the insert in the event of a cable rip.

As well as MultiProtect, ContiTech will be showcasing a further development of its ViProtect vibration analysis app for iOS and Android. With the app installed, users can now use their smartphones to analyze vibrations in vehicle cabs, engines and other industrial equipment. Excessive vibration can result in overloading of key components, leading to damage and, ultimately, prolonged and expensive repair shutdowns. Targeted tests help to analyze the vibration characteristics of industrial vehicles and machinery. The app then uses this measurement data to find solutions and suggest options for a suitable suspension system. This helps increase machinery service life and improve user comfort.

hordon kim / hordon@icnweb.co.kr

Continue Reading
Advertisement
Click to comment

댓글 남기기

English News

Hyundai Mobis to Launch an ‘Open Innovation Center’ in Silicon Valley

Published

on

Hyundai Mobis begins to make a full-fledged commitment to discover promising global startups and invest in them… Another center to be opened in Shenzhen, China during the first half of next year

Hyundai Mobis has established an “Open Innovation Center,” M.Cube, at Silicon Valley in the U.S. to speed up the search and investment in global startups that have new vehicle technologies such as self-driving.

Also, the company will expand its research branch in Shenzhen, China into M.Cube by adding an investment role to it. M.Cube embodies the company’s commitment to open innovation activities, creativity and incubation.

Hyundai Mobis will use M.Cube as its core base to discover and invest in startups with strong growth potential in the areas such as self-driving (sensors, logic, software platforms), connectivity (Infotainment, biometrics) and innovative new businesses (AI, vehicle security), to strengthen its technologies for future vehicles. To this end, it has appointed as the head of M.Cube Dr. Sean Ryu, who has more than 20 years of experience in startup investments in the US, and will continue to expand the organization.

The M.Cube that is being readied to launch in Shenzhen next year will become its base with a focus on AI and Big Data. Hyundai Mobis is expecting, together with Chinese startups, to secure core technologies for autonomous driving and connectivity optimized for the local market. Shenzhen, which used to be the Chinese mecca of manufacturing industry and has now been transformed into the hub of the 4th industrial revolution, is considered as the best place to discover outstanding startups.

Hyundai Mobis believes that M.Cube will be a win-win for both itself and startups. The company will invest in startups possessing creative ideas, and startups can explore their growth potential with the help of the company’s expertise in core auto components and infrastructure.

“We’ll not just simply invest in startups, but also actively support them with our R&D capabilities such as self-driving and connectivity,” said Jeong Soo-kyeong, Sr. Vice VP of Hyundai Mobis. “Collaboration will be facilitated so that the ideas of startups can be effectively developed into vehicle optimization.”

Meanwhile, Hyundai Mobis is actively promoting open innovation with Korean startups by carrying out events such as M.Start contest. It has recently invested in StradVision which features world-class, deep learning-based image recognition technology and also announced that it is considering engaging in joint research and development with Genesis Lab and Linkflow.

● Strengthening the strategic collaboration with Hyundai CRADLE… as many as a dozen investments will be made into global startups by next year

Hyundai Mobis M.Cube is strengthening its strategic collaboration with Hyundai CRADLE. Through this, it plans to make around a dozen investments in global startups by next year.

Hyundai CRADLE focuses on integration between technologies for future vehicles such as mobility service and smart city and finished vehicles, and M.Cube on investments in startups that possess core technologies such as self-driving and connectivity. It is a strategy where they will establish a value chain that starts from core technologies, auto components, finished vehicles to future vehicles, and increase investment efficiency.

Hyundai Mobis will expand its investment in startups by collaborating with Hyundai CRADLE in areas where M.Cube has not been established such as Israel, Europe and Asia. In particular, Israel has many startups that are strong in areas such as vehicle security and sensors, and support from the government and universities there is abundant. In France and Northern Europe, where entrepreneurial activities per capita are higher, auto component and mobility startups are expected to be the main investment targets.

● The synergy between open innovation and research centers in both Korea and overseas are expected to be increased

Hyundai Mobis is expecting notable synergy effects between M.Cube and research centers located in Korea and overseas. It aims to integrate R&D capabilities gained from these research centers and core technologies acquired through investment in startups.

Of particular note, last August, Hyundai Mobis invested in StradVision which has world-class image recognition technology, and announced that it plans to develop a deep learning-based camera by 2020. It will be an upgraded next-gen AI camera made through integrating ADAS, the self-driving technology of Hyundai Mobis and image recognition technology of StradVision.

Hyundai Mobis is currently operating a technology research institute in Korea and a total of four overseas institutes in areas such as North America, China, Germany and India. The institutes, where a total number of 3,000 researchers are working now, play a role in establishing a roadmap for overall R&D of the company. Its leading role is vital in the entire scope of R&D such as self-driving, eco-friendly products and chassis components.

The overseas institutes are carrying out customized R&D activities for each region. The institute in North America is developing prior art such as self-driving, the one in China is developing auto components for local vehicles, the one in Europe is making sensors and chassis components and the one in India is increasing its research capability specializing in software. Aside from this, the company also has a research institute in Vietnam that conducts analysis on self-driving data.

Continue Reading

English News

Mitsui Chemicals POLYMETAC to Be Used in Lightweight Frames of New Autonomous Unmanned Aerial Vehicles

Published

on

Aerosense's New Autonomous Unmanned Aerial Vehicle

Lightweight and reduction of the number of parts lead to simple structure using metal resin integrally molded technology

Mitsui Chemicals Inc.(President & CEO: Tsutomu Tannowa) announced that the Group’s unique metal resin integral technology, POLYMETAC has been selected for use in the frames of new autonomous unmanned aerial vehicles which are currently being developed by Aerosense Inc. (CEO: Hisashi Taniguchi), a joint venture of Sony Mobile Communications Inc. and ZMP Inc.

POLYMETAC is Mitsui Chemicals’ completely new technology for strong adhesion and bonding of various metals and resins that was not possible using conventional methods.

Aerosense's New Autonomous Unmanned Aerial Vehicle

Aerosense’s New Autonomous Unmanned Aerial Vehicle

Out of Mitsui Chemicals’ numerous lightweight solutions, POLYMETAC cuts weight and helps to reduce the number of parts and steps in the manufacturing processes as well. It is a completely new technology that provides totally new hybrid solutions.

Mitsui Chemicals provides Aerosense with hybrid product of carbon fiber reinforced plastic (CFRP) and aluminum joint parts made by its POLYMETAC technology and provides full support in shaping and designing the parts which will be used in the frame of aerial vehicle.

The new joint parts greatly enhance the structural rigidity of aerial vehicles while significantly reducing weight and providing simpler designs by eliminating the need for fasteners such as bolts.

“Our autonomous unmanned aerial vehicles provide solutions to various industrial needs. It is important that we are able to provide greater flight distances and improved performance by reducing weight and the number of parts while ensuring durability and strength of our aerial vehicles,” says Hisashi Taniguchi, CEO of Aerosense. “Mitsui Chemicals’ POLYMETAC technology makes it possible to extend flight distance by 40% providing our customers with greater added value.”

“POLYMETAC allows adhesion and bonding of various metals and resins, and for the current project, CFRP and aluminum parts were integrated by its technology,” says Akio Hirahara, General Manager of Mitsui Chemicals’ New Market Development (Automotive Materials) Division. “Mitsui Chemicals used its cutting edge simulation technology to design simple joint shapes with a single part which were originally composed of approximately 20 pieces. The technology contributes to a 50% weight reduction of joint parts while improving rigidity.”

Mitsui Chemicals will continue to pursue new uses and development of POLYMETACTM technology for state-of-the-art lightweight solutions in automotive and electrical applications.

Continue Reading

English News

Arm launches Neoverse, infrastructure IP portfolio for 5G and cloud to edge infrastructure

Published

on

logo arm

Delivering the world-class performance, security, and scalability required to support the diverse compute requirements of the next-generation infrastructure from hyperscale to edge access

Last week at Arm TechCon, Arm disclosed details on a dedicated roadmap and new brand of infrastructure-class IP for 5G networks and next-generation cloud to edge infrastructure. Arm® Neoverse® solutions are uniquely designed for higher-levels of performance, security, and scalability not seen today. Innovation from microarchitecture design up through silicon, software, and systems will enable best-in-class solutions to address the diverse and evolving requirements across the entire compute spectrum.

Arm also provided a first look at its Neoverse processor IP roadmap, with early details on upcoming platforms optimized for leading-edge process nodes. The new roadmap is designed specifically for infrastructure, beginning with the launch of the “Ares” IP platform in early 2019 on 7nm and delivering staggering performance gains of 30 percent per generation through 2021. The Neoverse IP roadmap has been specifically architected for the unique performance, efficiency, and scalability requirements needed to keep up with changing data patterns, new workloads, and the ever-increasing demands of an infrastructure evolving to support a trillion intelligent devices.

arm 네오버스(neoverse)

arm 네오버스(neoverse)

“Today Arm is sending disruptive shockwaves across the cloud, networking and storage world as Arm Neoverse delivers the foundation for the new global infrastructure to enable a trillion connected devices,” said Drew Henry, senior vice president and general manager, Infrastructure Line of Business, Arm. “Arm Neoverse IP will enable a broad set of our ecosystem partners to transform infrastructure from cloud to edge and push compute to where it’s most needed, store data where most appropriate, and evolve networking to securely connect this complex world.”

In his TechCon keynote, Henry shared his vision for the new infrastructure and the diverse range of use cases Neoverse will address, including hyperscale cloud datacenters, storage solutions, and 5G networks. Arm Neoverse is based on guiding design principles centered around:

  • World-class high performance, secure IP and architectures purpose-built for cloud native and networked workloads
  • A highly-scalable set of IP optimized for leading-edge process nodes, including “Ares” (7nm), “Zeus” (7nm+), and “Poseidon” (5nm), designed to enable systems across the infrastructure
  • A robust ecosystem empowered to build unique and diverse solutions targeting a wide range of use-cases through leveraged investment in unified software, tools, and silicon platforms

“The modern datacenter is no longer a physical construct, but a center of data and compute residing in the cloud and on the edge. More than ever, organizations must consider distributed, connected datacenter design methods to support the data and devices coming in the 5G world,” said Patrick Moorhead, Principal Analyst, Moor Insights & Strategy. “Arm is one of those rapidly emerging in the market and with Arm Neoverse purpose-built IP, it should be well-positioned to support many of the compute spectrum needs from hyperscale to edge access.”

Designing IP and system architectures for focused markets such as server, automotive, and networking has been a key priority for Arm over the past year. In the infrastructure space specifically, Arm has already been successful as the largest architecture deployed in the global internet infrastructure with nearly 30%-unit share. This achievement highlights not only a shift in preferred architecture, but the pervasiveness of Arm-powered technologies across the entire infrastructure market.

The announcement of Neoverse underscores the continued investment Arm and the ecosystem are making to deliver more ubiquitous compute from the cloud to the edge while delivering world-class performance and efficiency for the next generation of distributed cloud to edge infrastructure.

arm 네오버스(neoverse)  Roadmap

arm 네오버스(neoverse) Roadmap

[Supplemental Quote]

Ampere

“Ampere is actively developing high-performance Arm-based server CPUs and platforms for the future of hyperscale, cloud, and edge computing,” said Rohit Vidwans executive vice president of Engineering at Ampere Computing. “We are excited about Arm’s commitment to growing the ecosystem of Arm products into new areas with the Neoverse announcement.”

 

Broadcom

“Combing Arm’s long-term infrastructure roadmap with Broadcom’s best in class networking technology, Broadcom delivers leadership performance products for the datacenter that are still power efficient. Arm’s roadmap enables optimizations that accelerate customer workloads for the evolving compute and connectivity requirements of tomorrow’s datacenter,” said Ed Redmond, senior vice president and general manager, Compute and Connectivity, Broadcom, Inc.

 

Marvell

“Marvell® Infrastructure Processors are extensively deployed in a variety of leading network products. They are designed to analyze, secure, compute, and transform in both wired and wireless networks from the edge to the core,” said Raj Singh, senior vice president and general manager, Infrastructure Processors BU, Marvell Semiconductor Inc. “As a long term technology licensee, as well as an Arm IP customer, Marvell is very pleased to see this increased focus on the enterprise and 5G markets with Neoverse IP. We believe this will greatly benefit the whole Arm ecosystem in providing high performance and power-efficient solutions for the next generation of network infrastructure and compute.”

 

RedHat

“Choice allows businesses to select the best solution for their needs, and this is true all the way down to the underlying architecture. It’s up to software vendors like Red Hat to be able to support this demand for choice from our customers as they extend operations into the hybrid cloud,” said Stefanie Chiras, vice president and general manager, Red Hat Enterprise Linux, Red Hat. “With this emphasis on choice front and center, we look forward to supporting solutions from the Arm Neoverse ecosystem as our customers seek to match their evolving business requirements to the most appropriate enterprise IT solutions.”

 

TSMC

“Time to market in today’s rapidly evolving infrastructure requires proven, scalable IP, development tools, advanced processes, and a complete ecosystem to provide compelling solutions,” said Suk Lee, senior director of Design Infrastructure Marketing Division at TSMC. “The Arm Neoverse ecosystem leverages our most advanced processes to provide the highest performance solutions to a highly connected world.”

 

Xilinx

“High-performance IP, along with a complete ecosystem, enables customers to take full advantage of the flexibility inherent in our Arm-based products, said Gaurav Singh, vice president, architecture and verification, Xilinx. “The evolution of these cores, coupled with the capability of CCIX, provide an ideal platform for smart offload and purpose-driven edge compute platforms. We congratulate Arm on the launch of Neoverse and are looking forward to what it might enable.”

 

more info: https://www.arm.com/solutions/infrastructure

Continue Reading

배너광고

Power Electronics Mag
스마트공장 자동화 산업전
Japan ITweek
네스트필드
  • 지멘스
  • HMS Anybus
  • 힐셔코리아
  • 슈나이더 일렉트릭
  • 비앤드알 산업자동화
eBook 보기

책 판매대

SPS 2018
물류기술 매거진
Advertisement

Trending

© Copyright 2006-2018 아이씨엔미래기술센터 All Rights Reserved.
tel. 0505-379-1234, fax. 0505-379-5678 | e-mail. icn@icnweb.co.kr | Powered by WordPress Flex Mag Theme. Theme by MVP.
Address: 57-25 4F, Changcheon-dong, Seodaemun-gu, Seoul, 03789, Korea
주소: 서울특별시 서대문구 연세로5나길 10 (창천동, 4층)
업체명: 아이씨엔, 사업자등록번호: 206-11-69466, 통신판매업신고증: 2009-서울서대문-0373호
기사제보 : news@icnweb.co.kr 반론청구 : oseam@icnweb.co.kr

아이씨엔의 모든 콘텐츠는 저작권법의 보호를 받습니다. 이의 일부 또는 전부를 무단 사용하는 것은 저작권법에 저촉되며, 법적 제재를 받을 수 있습니다.


[[클린 광고 선언]]
아이씨엔매거진은 어떠한 경우에도 성인, 성형, 사채, 폭력, 투기, 악성SW 및 환경파괴(원자력 포함) 관련 광고는 게시하지 않습니다.
[광고 신고: oseam@icnweb.co.kr]