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Intelligent equipment for smart production

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“Industrial production is on the verge of a fundamental change,” underlined Dr. Markus

Klaiber, CTO of SCHUNK GmbH & Co. KG in Lauffen, Germany with a view to EMO 2017. ”In the years ahead, the digitalization, use of mechatronic products, and automation of production processes, collaboration between humans and robots as well as intelligent networking of all process-relevant components will promote a new concept of industrial production.” The primary focus will be on three aspects: communication between all the components involved, maximum transparency within the system, component, control technology and corporate levels, and flexible responses to external and internal events.

”The used types of clamping devices and gripping systems are of significant importance in all three of these areas,” the production specialist emphasized while maintaining SCHUNK’s position as the world’s leading supplier in both segments: ”Our aim is to utilize the exposed position of our modules ”closest-to-the-part” in the future, in order to enable detailed monitoring of every individual process step as well as to permanently supply the higher-level ERP system control and cloud solutions with process data and to be able to react flexibly to any respective events.”

SCHUNK

SCHUNK

Autonomous handling scenarios

SCHUNK already provides a large number of clamping force blocks that are capable of communication, fully automated palletizing systems and quick-change solutions for flexible production. The family-owned company will continue to expand its Industry 4.0 portfolio at the EMO. The highlight will be a functional manufacturing cell in which an intelligent SCHUNK EGL PROFINET gripper with variable power and positioning enables autonomous handling scenarios, and ensures fully automated quality assurance. Without the need for additional external sensors, the gripper autonomously detects defective components and decides for itself whether the part should be removed from the process. The recorded information can be continuously transferred to the machine control system, to higher-level internal and external systems as well as to cloud solutions for statistical process analyses. All the process steps are monitored in real time and superordinate levels such as ERP systems or cloud-based monitoring platforms are provided. In addition, SCHUNK is pushing the trend toward fluid-free, highly interconnected machine tools with the VERO-S NSE-E mini – the first global electrically controlled 24V quick-change pallet module.

System program for workpiece direct clamping

SCHUNK is even setting the stage for exciting new products for mechanical clamping systems that reduce idle times, increase productivity of machine tools and enable flexible processes. Therefore SCHUNK is going to further expand its modular system for workpiece direct clamping modules, to expand its portfolio of lightweight chucks and, after numerous successful customer tests, to get the ball rolling with the slim, vibration damping TENDO Slim 4ax hydraulic expansion toolholder. The underlying message: ”Easy to use, easy to integrate, easy to maintain,” says Dr. Markus Klaiber. ”Because modern gripping systems and clamping devices are the key to efficient and flexible production processes.”

hordon kim / hordon@icnweb.co.kr

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IOTSWC18 will portray an industrial future marked by IoT, IA and Blockchain

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IOTSWC 2018

The fourth edition of the IoT Solutions World Congress (IoTSWC) –international reference event on the innovations of the industrial internet of things–, will bring together, between 16 and 18 October in the Gran Via venue of Fira de Barcelona, 341 exhibitors and 316 speakers from all over the world with the aim of showing the transforming capacity of the IoT in different industrial and business environments, and also show its alignment with artificial intelligence and the blockchain.

IOTSWC 2018

The Leading IoT Industry  Event Barcelona 16-18 October 2018 (image. IoTSWC)

Organised by Fira de Barcelona in collaboration with the Industrial Internet Consortium (IIC), IoTSWC has registered a new growth in the number of participating companies, from 240 in 2017 to 341 in 2018, and expects 14,000 attendees from 114 countries. An evolution in line with the widespread deployment of IoT in various industries due to the potential for improvement in efficiency, automation and results.

Therefore, the director the IoTSWC, Roger Bou, is convinced that the 2018 edition will prove that this technology is here to stay, with its rapidly growing presence in industry: “We can see that no longer is IoT a technological revolution waiting just over the horizon; it is a reality that is being implemented ever more often and has an enormous potential to transform all types of businesses and our day-to-day lives”.

In fact, the Gartner consulting firm has predicted there will be 11.2 billion connected things in the world by the end of 2018 –4.159 billion in industry and specific industries alone. In other words, an upsurge of 32% in these areas with respect to 2017. On the other hand, experts also predict 2018 to be the year in which IoT makes a real impact in the market, spurring new business and service models.

New applications and testbeds

The exhibition area will bring together the leading companies in areas such as information technology, software platform developers, hardware manufacturers, security companies, telecommunications and service operators, or industrial automation firms that will show attendees their latest solutions and applications. The following, among others will be among the 341 companies attending: ABB, Cryptoquantique, Dassault Systems, Deloitte, Fiware, Google Cloud, Hitachi, Huawei, Intel, Kaspersky, Libelium, Microsoft, PTC, Relayr, Rigado, SAS, Software AG, Telefonica, Telit, Thinstream, Uptake, Verizon, Vodafone and Wipro.

Among the new applications, the connected winery developed by Vodafone and Bodegas Emilio Moro stands out which, through a Narrowband IoT platform,sensors in the field, Big Data and satellite technology allow to maximise the performance of the winery and minimise the environmental impact of wine production. In addition, the event will have an area dedicated to testbeds, where live demonstrations of innovative industrial internet applications will be carried out. In total 10 examples will be given, among them an intelligent platform to control water quality in Alaska and save beluga whales; an intelligent entrance gate that can be opened when the owner arrives or transform his/her garage into a giant mailbox for the delivery of online purchases; a 3D printing solution to analyse the client’s foot in real time and design and produce custom-made shoes within a couple of hours; and a fully connected and sensorized fire truck.

The 2018 IoTSWC will also be paying tribute to the year’s most ground-breaking and influential projects with their IoT Solutions Awards, which are open to companies and entities all over the world.

Blockchain, Artificial Intelligence and more

On its side, the Conference will bring together the best global experts in IoT technology and representatives of various industrial industries to address the impact of IoT solutions in different environments. Nine core themes have been established for the 2018 edition, as touchstones for the more than 204 scheduled seminars: connected transport, product manufacturing, healthcare, energy and utilities, construction and infrastructure, open industry, enabling technologies, blockchain and artificial intelligence, with these last two having their very own forums.

The following stand out among the 316 speakers: Jonathan Ballon, VP of Intel; Hajime Sugiyama, Overseas Strategic Planning at Mitsubishi Electric; Seb Chakraborty, CTO of British Gas; Alexander Botsor, innovation Project Manager of BMW; Tomi Teikko, Director of Empathic Building of Tieto; Fabian Simmer, Technology Officer at Seat; Cristopher Bailey, director of Innovation and Architecture at Matson; Francisco Torres, Production manager at Pernod Ricard; and John Denning, CTO of Universal Medical, among others.

The technological gender gap and how to overcome it will also be analysed at the congress. IoTSWC will address the leadership role of women in the IoT ecosystem in a session that will have six women leaders in industrial IoT: Jennifer Bennett, Technical Director, Office of the CTO of Google Cloud; Leila Dillon, VP of Global Marketing & NA Distribution at Big Belly; Helena Lisachuk, Director and IoT Global Leader at Deloitte; Beverly Rider, executive vice-president and commercial director of Hitachi; Eva Schönleitner, vice-president of digital societies at ABB; and Adriana Estévez, Executive Director of Transformation and Digital Innovation at Microsoft.

The content and scope of the event was defined in large part thanks to the involvement of the Industrial Internet Consortium (IIC), a worldwide organization of over 250 companies and entities related to IoT whose aim is to collectively make strides in the industrial Internet. The executive director of IIC, Richard Soley, emphasizes the standard of the attendees and demonstrations of the live systems at the IoTSWC: “IoT Solutions World Congress remains the main industrial IoT event of the year. It gives attendees the chance to meet the leaders who have been working in the field of the IoT for some time; to listen to the experts, for specific companies and industries to share success stories, and also to provide the opportunity to see the benefits of the industrial internet in action with our focus on fully functional test benches”.

Barcelona Industry Week

The IoT Solutions World Congress forms part of Barcelona Industry Week, a brand which also encompasses two other trade shows, In(3D)ustry From Needs to Solutions, dedicated to additive manufacturing, and Healthio, specializing in health and healthcare technologies. All three events, which create synergies and provide a platform for commerce and knowledge in a wide range of industrial sectors, will take place from 16-18 October at Fira de Barcelona.

 

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English News

Nexperia, New 175°C AEC-Q101 MOSFETs in miniature leadless packages for enable automated inspection

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Nexperia 175°C AEC-Q101 MOSFETs

Nexperia announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175 °C and are available in the AOI-compatible DFN2020 package (DFN = Discrete Flat No leads). More, the new devices measure just 2 mm x 2 mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.

Nexperia 175°C AEC-Q101 MOSFETs

Nexperia 175°C AEC-Q101 MOSFETs

Many leadless packages cannot be inspected using AOI techniques, so Nexperia pioneered the development of the DFN2020 package with side-wettable flanks (SWF), enabling Automatic optical inspection (AOI) – a critical automotive industry requirement – to be employed. Packages with SWF are now a proven, accepted solution.

Comments Malte Struck, Nexperia’s product manager for small signal MOSFETs: “The DFN package with side-wettable flanks is gaining significant traction with automotive manufacturers as it saves space and can be automatically inspected. Our new 175 °C parts are being used in under-the-hood applications, especially near the engine or gearbox. The unique offering of an automotive-grade MOSFET that is both qualified to 175 °C and which incorporates side-wettable flanks makes the DFN2020 additionally suitable for a wide range of medium-power automotive applications.”

The new automotive-qualified parts extend Nexperia’s low and medium power MOSFET portfolio. Six 40 V and 60 V devices are available with the higher temperature rating and automotive approval, each with low RDS(on) of between 20 mΩ and 40 mΩ.

More information on the new DFN2020 MOSFETs (BUKxxx) including product specs and datasheets is available at https://efficiencywins.nexperia.com/efficient-products/DFN2020-Automotive-MOSFETs.html

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